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Elevator structures, bonding

The infrared spectroscopy shows the presence of surface SiOH groups [35,36]. Infrared spectra also reveal the surface B-OH groups but only after degasing of CPG at elevated temperatures under vacuum conditions [32-34,37], Geminal OH structures bonded with Si as well as B atoms can be detect among hydroxyl groups [38]. [Pg.38]

The resorcinol resins used for structural bonding applications are cured at room temperature, or slightly elevated temperatures, " and have a... [Pg.93]

ADHESIVE BONDING OF ELEVATOR STRUCTURES AND BOXES FOR ELECTRONIC EQUIPMENT ... [Pg.131]

Because thermosetting resin adhesives, when cured, are densely cross-linked, their resistance to heat and solvents is good, and they show little elastic deformation under load at elevated temperatures. Bonds are able to withstand temperatures of 93—260°C and peel strength is fair. The major application is for stressed joints at somewhat elevated temperatures. Most materials can be bonded with thermosetting adhesives, but the emphasis is on structural applications [7]. Examples of thermosetting adhesives are given in Table 4.1. [Pg.71]

Bis(diamino)alanes (R2N)2A1H were used for the hydroalumination of terminal and internal alkenes [18, 19]. TiCb and CpjTiCb are suitable catalysts for these reactions, whereas CpjZrCb exhibits low catalytic activity. The hydroaluminations are carried out in benzene or THF soluhon at elevated temperatures (60°C). Internal linear cis- and trans-alkenes are converted into n-alkylalanes via an isomerization process. Cycloalkenes give only moderate yields tri- and tetrasubstituted double bonds are inert. Hydroaluminahon of conjugated dienes like butadiene and 1,3-hexa-diene proceeds with only poor selechvity. The structure of the hydroaluminahon product of 1,5-hexadiene depends on the solvent used. While in benzene cyclization is observed, the reaction carried out in THF yields linear products (Scheme 2-10). [Pg.57]

The Raman spectra (0-1400 cm l) shown in Fig re 6 illustrate the structural changes which accompany the consolidation of silica gels. The 1100°C sample is fully dense, whereas the 50 and 600°C samples have high surface areas (1050 and 890 m2/g), respectively. The important features of the Raman spectra attributable to siloxane bond formation are the broad band at about 430 cm 1 and the sharp bands at 490 and 608 cm 1(which in the literature have been ascribed to defects denoted as D1 and D2, respectively). The D2 band is absent in the dried gel. It appears at about 200°C and becomes very intense at intermediate temperatures, 600-800°C. Its relative intensity in the fully consolidated gel is low and comparable to that in conventional vitreous silica. By comparison the intensities of the 430 and 490 cm 1 bands are much more constant. Both bands are present at each temperature, and the relative intensity of the 430 cm 1 band increases only slightly with respect to D1 as the temperature is increased. Figure 7 shows that in addition to elevated temperatures the relative intensity of D2 also decreases upon exposure to water vapor. [Pg.325]

Figure 5.1 shows a schematic elevation through a kink on a screw dislocation in the diamond crystal structure. The black circles lie in the plane of the figure. The white ones lie in a plane in front of the figure, and the gray ones in a plane behind the figure. The straight lines represent electron pair bonds... [Pg.67]

Figure 5.1 Schematic elevation view of the center of a kink on a screw disocation in the diamond crystal structure. D0 is the bond length, b is the Burgers displacement. The black circles are in the central plane of the figure. The white circles lie in a plane slightly in front of the central plane, while the gray circles lie in a plane slightly behind the central plane. Figure 5.1 Schematic elevation view of the center of a kink on a screw disocation in the diamond crystal structure. D0 is the bond length, b is the Burgers displacement. The black circles are in the central plane of the figure. The white circles lie in a plane slightly in front of the central plane, while the gray circles lie in a plane slightly behind the central plane.
In contrast, methyl cyclopropenone is reported283) to react with the Pt-olefin complex 455 at low temperature with replacement of the olefin ligand. In the resulting complex 456 the cyclopropenone interacts with the central atom via the C /C2 double bond according to spectroscopic evidence284). At elevated temperatures a metal insertion to the C1<2)/C3 bond occurs giving rise to 457. Pt complexes of a similiar type were obtained from dimethyl and diphenyl cyclopropenone on reaction with 455 and their structures were established by X-ray analysis285). [Pg.93]


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