Electronic cooling

Mohapatra S, Loikitis D (2005) Advances in liquid coolant technologies for electronics cooling. 

Ng EYK, Poh ST (1999) Investigative study of manifold microchannel heat sinks for electronic cooling design. J Electron Manuf 9(2) 155-166... 

Shih JC, Ho C-M, Liu J, Tai Y-C (1996) Monatomic and polyatomic gas flow through uniform microchannels. Microelectromech Syst (MEMS) DSC 59 197-203 Simons RE (1996) Direct liquid immersion cooling for high power density microelectronics. Electron Cooling 2(2) 7-12... 

Zhao CY, Lu TJ (2002) Analysis of micro-channels for electronic cooling. Int J Heat Mass Transfer 45 4857-4869... 

Any problems in the setup, startup, and operation of the CBMS also were recorded in the course of the field tests. These observations are important to improving the system before it goes into production. The field tests revealed three problems. The protective screens over electronics cooling air inlets and outlets on the CBMS II housing were damaged by operator activities in the vehicles and required reinforcement. The ground probe head, which protrudes outside the vehicle hull, required more power to maintain the correct temperature under colder or wetter weather conditions. Finally the automated mass and frequency calibration procedure was not reliable in the field and required modification. These problems have been corrected and are being incorporated in the LRIP units. 

Graphite (a) molecular structure and (b) SEM micrographs after exfoliation. (Figure 12.5b reproduced from website www.electronics-cooling.com/assets/images/, February 2007 Inagaki, M., and Suwa, T., Carbon, 39, 915-920,2001. With permission.)... 

Available on website, www.electronics-cooling.com/assets/images/, February 2007. 

The costs of a PEMFC stack are composed of the costs of the membrane, electrode, bipolar plates, platinum catalysts, peripheral materials and the costs of assembly. For the fuel-cell vehicle, the costs of the electric drive (converter, electric motor, inverter, hydrogen and air pressurisation, control electronics, cooling systems, etc.) and the hydrogen storage system have to be added. Current costs of PEM fuel-cell stacks are around 2000/kW, largely dominated by the costs of the bipolar plates and... 

Describe and compare electron cooling and stochastic cooling. 

Hall, D.S. and Gabrielse, G. (1996). Electron cooling of protons in a nested Penning trap. Phys. Rev. Lett. 77 1962-1965. 

Hush, N. Molecular electronics. Cool computing. Nature Mater. 2, 134-135 (2003). 

Fig. 4. First demonstration of electron cooling in the ATHENA test runs. The peak on the right side is produced by antiprotons which have been cooled to energies below 10 eV and trapped in the central, harmonic region of the ATHENA catching trap...

Such combined convective flows are normally associated with low forced velocities. They can occur, for example, in some electronic cooling situations and in some heat exchangers. 

Still another method of evaluating fin performance is discussed in Prob. 2-68. Kern and Kraus [8] give a very complete discussion of extended-surface heat transfer. Some photographs of different fin shapes used in electronic cooling applications are shown in Fig. 2-13. 

Fig. 2 -13 Some fin arrangements used in electronic cooling applications. (Courtesy Wakefield Engineering Inc., Wakefield, Mass.)...

Short-wavelength photons (of energy much greater than Eg) create hot carriers. If, somehow, thermalization of these carriers can be avoided, photoelectrochemical reactions that would otherwise be impossible with the cooled counterparts, i.e., at very negative potentials for n-type semiconduetors, would be an intriguing possibility. The key issue here is whether the rate of electron transfer across the interface can exceed the rate of hot electron cooling. The observation of hot carrier effects at semiconductor-electrolyte interfaces is a controversial matter (see, e.g.. Refs. [3],... 

For example, the temperature of a resistance wire rises rapidly when electric current passes through it as a result of the electrical energy being converted to heat at a rate of i R, where I is the cuirent and R is the electrical resistance of the wire (Fig. 2-9). The safe and effective removal of this heat away from the sites of heat generation (the electronic circuits) is the subject of electronics cooling, which is one of the modem application areas of heat transfer. 

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