Electrodeposition theory

Nikolic ND, Popov Kl (2010) Hydrogen co-deposition effects on the structure of electrodeposited copper. In Djokic SS (ed) Electrodeposition theory and practice, modem aspects of electrochemistry, vol 48. Springer, New York, pp 1-70... 

For a description of electrogravimetry, see the following resource. Tanaka, N. Electrodeposition, In Kolthoff, I. M. Living, P. J., eds. Treatise on Analytical Chemistry, Part I Theory and Practice, Vol. 4. Interscience New York, 1963. 

Aqueous Electrodeposition. The theory of electro deposition is well known (see Electroplating). Of the numerous metals used in electro deposition, only 10 have been reduced to large-scale commercial practice. The most commonly plated metals are chromium, nickel, copper, zinc, rhodium, silver, cadmium, tin, and gold, followed by the less frequendy plated metals iron, cesium, platinum, and palladium, and the infrequendy plated metals indium, mthenium, and rhenium. Of these, only platinum, rhodium, iddium, and rhenium are refractory. 

Anodic deposition is controlled by either fluid shear (cross-flow filtration) (48), similar to gel-polarization control, or by continual anode replacement (electrodeposited paints) (46). High fluid shear rates can cause deviations from theory when E > (49). The EUF efficiency drops rapidly... 

MaksimoviC, M. D. Theory of the Effect of Electrodeposition at a Periodically Changing Rate on the Morphology of Metal Deposits 19... 

Much of the theory of scaling analysis was developed for molecular beam epitaxy (MBE), and there are some challenges in transferring the treatment to electrodeposition. In MBE, the incident atoms originate at a source at high temperature, arrive at the growth front from a vapor phase that is not in internal equilibrium, attach... 

The incorporation of a third element, e.g. Cu, in electroless Ni-P coatings has been shown to improve thermal stability and other properties of these coatings [99]. Chassaing et al. [100] carried out an electrochemical study of electroless deposition of Ni-Cu-P alloys (55-65 wt% Ni, 25-35 wt% Cu, 7-10 wt% P). As mentioned earlier, pure Cu surfaces do not catalyze the oxidation of hypophosphite. They observed interactions between the anodic and cathodic processes both reactions exhibited faster kinetics in the full electroless solutions than their respective half cell environments (mixed potential theory model is apparently inapplicable). The mechanism responsible for this enhancement has not been established, however. It is possible that an adsorbed species related to hypophosphite mediates electron transfer between the surface and Ni2+ and Cu2+, rather in the manner that halide ions facilitate electron transfer in other systems, e.g., as has been recently demonstrated in the case of In electrodeposition from solutions containing Cl [101]. 

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