Dry cleaning method

Yarn lubricants. Self-emulsifled lubricants developed to meet specific low sling characteristics where atmospheric conditions warrant attention to oil vapor control. Possess excellent scourability properties for ease of removal by aqueous or dry cleaning methods. 

Methods of dust removal depend mainly on the particle size of the dust and the temperature and moisture content of the gas. The methods used are broadly divided into dry methods and wet methods. The dry methods involve the use of gravity and baffle chambers, cyclones, filters, and electrostatic precipitators, while the wet methods involve the use of spray towers and venturi scrubbers. In principle, wet cleaning is preferred to dry cleaning because of the excessive wear associated with and the difficulty in handling the fine dusty material removed in the dry methods. The wet methods, however, must be followed by such operations as filtration, drying of filter cakes, and recycling of water. 

Another challenge is to develop methods to replace the volatile organic solvents that are used in many industrial procedures. One choice is water as a solvent it is easily repurified, and has a harmless vapor. Another choice is supercritical carbon dioxide, a good solvent for many organic substances. It is not as innocuous as is water, but carbon dioxide can be easily recovered and reused. It is currently used to remove caffeine from coffee, and is being developed as a dry-cleaning solvent to replace organic solvents (Chapter 9). 

Freeze drying plants must be easily cleaned, a task which for pilot installations may be done by hand. This is difficult to document and one has to rely on the experience and conscientiousness of the operator. Gaster [2.16] presents a survey of advantages and disadvantages of cleaning methods from hand operation to spray sysfems with a sequence of... 

The existing cleaning methods can be divided into wet and dry cleaning. The wet cleaning process uses a combination of solvents, acids, surfactants and deionized (DI) water to spray and dissolve contaminants from the surface area. The Dl water is used to rinse after each chemical use. The oxidation of the wafer surface is sometimes integrated into the cleaning... 

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