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Dry Chemical Etch

The types of etching process are divided into wet or dry chemical etching and isotropic or anisotropic etching as shown in Figure 2.7. [Pg.26]

Anisotropic dry chemical etching of silicon (reactive ion etching, RIE). [Pg.27]

Mueller, M. R., and Kuseh, R. F., Safety and Health Implications of Dry Chemical Etching, IBM General Technology Division Technical Bulletin TR19.90323, Burlington, VT (Nov. 2, 1987)... [Pg.376]

If the material etched away is removed as a liquid, the term used is wet chemical etching. The term dry chemical etching is used when the material is removed in the gaseous state. Each type can be isotropic, with the same etch rate operating in all directions, or anisotropic, with etch rates reflecting direction, which may be a spatial direction or the crystal orientation. [Pg.61]

See other pages where Dry Chemical Etch is mentioned: [Pg.410]    [Pg.21]    [Pg.31]    [Pg.65]    [Pg.67]    [Pg.69]    [Pg.546]    [Pg.546]    [Pg.68]    [Pg.238]    [Pg.681]    [Pg.3490]    [Pg.199]    [Pg.91]    [Pg.49]    [Pg.164]    [Pg.428]    [Pg.428]    [Pg.1684]    [Pg.78]    [Pg.246]    [Pg.517]    [Pg.55]    [Pg.61]    [Pg.65]   
See also in sourсe #XX -- [ Pg.428 ]



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