Drain holes presence

The sequence will persist until the glass beaker breaks, either by the corrosion of the material due to the presence of water or by mechanical stresses resulting from pressure exerted both by corrosion products and ice. On the other hand, in the presence of a drainage hole or if the glass is upside down, the glass itself would be wetted by fog or rainwater, and the rain would result in the removal of dust and other accumulated materials. The real stresses and the outcome would be completely different from the previous case of right-side-up exposure in the absence of draining hole. 

Device fabrication requires the successive deposition of a series of layers of metal, polymer and insulators, with appropriate patterning in the case of the MISFET for the formation of the source and drain areas. We use simple metal evaporation, of gold as an ohmic contact and, typically, aluminium as a blocking contact. Thus, to fabricate a Schottky barrier diode, we deposit a bottom layer of gold onto the substrate, coat this with the polyacetylene layer, and put the low work function metal such as aluminium or indium on top of this. The Schottky barrier diode is obviously very sensitive to the presence of pin-holes in the polymer layer, and we have therefore aimed to keep the thic ess of the polyacetylene layer sufficiently high so that the chances of this failure mode are reduced to a low level. We have worked typically with polymer layer thicknesses of around 1 xm. 

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