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Dielectric conditions

Additionally, a set of tripeptide sequences was extracted from the PDB and analyzed to derive torsion histograms describing the conformational preferences of peptidic portions in ligands. Implicitly, these histograms contain the information about the conformational behavior of molecules in a structured molecular environment with varying intermolecular directional forces and dielectric conditions in the... [Pg.188]

The locations of the maxima of the -field and the E-field are different depending on the mode chosen for the EPR experuuent. It is desirable to design the cavity in such a way that the B field is perpendicular to the external field B, as required by the nature of the resonance condition. Ideally, the sample is located at a position of maxuuum B, because below saturation the signal-to-noise ratio is proportional to Simultaneously, the sample should be placed at a position where the E-field is a minimum in order to minimize dielectric power losses which have a detrimental effect on the signal-to-noise ratio. [Pg.1560]

Felderhof B U 1980 Fluctuation theorems for dielectrics with periodic boundary conditions Physice A 101 275-82... [Pg.2282]

The solvent dielectric constant, ionic strength and temperature are chosen to fit the conditions of the experimental studies. The protein dielectric constant is assigned some small value, e.g. 4. The PB calculations are currently carried out with the atomic charges and radii of the PARSE parameter set, developed by Honig and coworkers [17] or that for CHARMM [12]. The PARSE parameter set... [Pg.182]

For gases the values of the dielectric constant can be adjusted to somewhat different conditions of temperature and pressure by means of the equation... [Pg.496]

Under the same conditions. Maxwell s theory of radiation shows that the refractive index and the relative dielectric constant are simply related by... [Pg.669]

Paschen s Rule and Breakdown Voltage. As pressure decreases to vacuum conditions, the breakdown voltage (BDV) first decreases, then increases, resulting in a minimum as shown in Figure 1. Table 3 gives BDV data for SF and other dielectrics. For optimum utiUty of a dielectric, a... [Pg.241]

Particle Contamination. In assembling large, high voltage equipment such as coaxial lines, contamination by metal particles may occur which may decrease the dielectric strength under various conditions by 5 to 10-fold (44—45). Metal needles are the worst contaminants and electrostatic traps or adhesive areas have been designed to cope with them (46). [Pg.242]

Dielectric Strength. Dielectric failure may be thermal or dismptive. In thermal breakdown, appHed voltage heats the sample and thus lowers its electrical resistance. The lower resistance causes still greater heating and a vicious circle, leading to dielectric failure, occurs. However, if appHed voltage is below a critical value, a stabilized condition may exist where heat iaput rate equals heat loss rate. In dismptive dielectric failure, the sample temperature does not iacrease. This type of failure is usually associated with voids and defects ia the materials. [Pg.300]

Heat treatment of related glasses melted under reducing conditions can yield a unique microfoamed material, or "gas-ceramic" (29). These materials consist of a matrix of BPO glass-ceramic filled with uniformly dispersed 1—10 p.m hydrogen-filled bubbles. The hydrogen evolves on ceranarning, most likely due to a redox reaction involving phosphite and hydroxyl ions. These materials can have densities as low as 0.5 g/cm and dielectric constants as low as 2. [Pg.326]

Water as an impurity accelerates the oxidation rate. Figure 4 compares growth curves for Si02 under dry and steam conditions. Halogens can also be introduced to the oxidation process, thereby reducing sodium ion contamination. This improves dielectric breakdown strength, and reduces interface trap density (15). [Pg.347]

Grade XXXPC is similar in electrical properties to Grade XXXP and suitable for punching at lower temperatures than Grade XXXP. This grade is recommended for apphcations requiring high insulation resistance and low dielectric losses under severe humidity conditions. [Pg.536]

Grade G-10, glass fabric with epoxy resin binder, has extremely high mechanical strength (flexural, impact, and bonding) at room temperature and good dielectric loss and electric strength properties under both dry and humid conditions. [Pg.537]


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Dielectric boundary condition

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