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Device encapsulation conditions

Device encapsulation conditions are summarized in Table IV. Upon completion of the encapsulation, the devices molded at 150°C were post baked for 16 hours at 150°C, and those molded at 175°C were post baked at that temperature. After trimming, clipping, and forming, the IC s had their final dual in-line package shape. The leads were dipped in 63/37 Sn/Pb solder using a halide-containing flux (Alpha 200). [Pg.386]

Table IV. Device Encapsulation Conditions (336 Cavity Mold)... Table IV. Device Encapsulation Conditions (336 Cavity Mold)...
Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. [Pg.530]

Similarly to the above-mentioned entrapment of proteins by biomimetic routes, the sol-gel procedure is a useful method for the encapsulation of enzymes and other biological material due to the mild conditions required for the preparation of the silica networks [54,55]. The confinement of the enzyme in the pores of the silica matrix preserves its catalytic activity, since it prevents irreversible structural deformations in the biomolecule. The silica matrix may exert a protective effect against enzyme denaturation even under harsh conditions, as recently reported by Frenkel-Mullerad and Avnir [56] for physically trapped phosphatase enzymes within silica matrices (Figure 1.3). A wide number of organoalkoxy- and alkoxy-silanes have been employed for this purpose, as extensively reviewed by Gill and Ballesteros [57], and the resulting materials have been applied in the construction of optical and electrochemical biosensor devices. Optimization of the sol-gel process is required to prevent denaturation of encapsulated enzymes. Alcohol released during the... [Pg.6]

Another common location for creep failures of encapsulated assemblies is at sharp corners or edges. Many encapsulants such as polyimides must be applied in thin coats, and coverage of points, edges, or corners is difficult or impossible. Sharp corners, characteristic of most thin-film devices provide ideal conditions for the initiation of creep failures due to the resulting irregularity of the encapsulant coverage. [Pg.303]

Since the Initial work of White (IQ), the Bell System and other major semiconductor users have extensively used silicones In the protection of numerous thin-film and thlck-fllm devices (24.25). The materials primarily have been condensation-cure silicones In xylene dispersion. The performance of encapsulated semiconductors used within the Bell System Is well documented (26). and studies continually In process support the use of silicones for the prevention of electronic component deterioration under conditions similar to the In-vlvo environment. [Pg.304]

Other advantages of microfabricated devices include faster response times, and the fabrication of multiple test sites for simultaneous replicate assays in one microfabricated device. This analytical redundancy provides a safeguard that is not easily attained in a conventional macroscale analyzer, where duplicate assays represent the usual extent of repetitive assay of a sample. Encapsulation technology used in the microelectronics industry may also be applicable to microscale devices and could be extended to operations over a wide range of environmental conditions of humidity, and temperature. [Pg.220]


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