D floorplans with and without thermal concern

Design Measures of merit Area wire length driven Area, wire length thermal driven 

Our floorplanning tools could serve as the prototype for future 2.5-D system designs. A full-fledged 2.5-D floorplanning tool should be equipped with many new feature features described as follows. 

Institute of Microelectronics, Tsinghua University Beijing 100084, P. R. China, dengyd tsinghua.edu.cn 

Electrical and Computer Engineering Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3891 USA, maly ece.cmu.edu 

Abstract This chapter covers the placement solutions for 2.5-D/3-D integrated circuits. Based on a partition technique, our placement techniques could handle VLSI circuits consisting of both standard cells and macros. The detailed result analysis justifies the potential of the 2.5-D integration approach to improve system performance and lower interconnect power consumption. 

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Table 5.4 3-D floorplans with and without thermal concern...

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