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Curing electronics adhesives agents

Epoxy adhesives are widely used in electronics assembly and packaging. They are formed by polymerizing epoxy resins having one or more terminal glycidyl ether (epoxy) groups with a variety of curing agents, hardeners, or catalysts. [Pg.77]

Surface-mount adhesives 35-50% epoxy resin, 1-10% amine or polyamine curing agent, and 10-30% mineral filler and thixotrope Mondur MC/castor oil and castor oil polyols (>60%), filler 5%) Eccobond 125F (Henkel), Epo-Tek 70E-4 (Epoxy Technology), Epi-bond 7275 (Cookson Electronics) Flexobond 442 (Bacon Industries)... [Pg.119]

Interfacial aspects and adhesion of polysulfides have been studied extensively and reported by us [3,17]. The epoxy-modified poly sulfide has improved adhesion due to chemical reactions that increase electronic attraction forces. Water has been found to be the most potent debonding agent in cured polysulfides. Formation of thiourethane is responsible for excellent adhesion of polysulfide onto polyurethane coatings. [Pg.535]

Uses Curing agent reactive diluent monomer (UV EB resin) and modifier for radiation-cured coatings, inks, electronics applies., paints, textile finishes, adhesives, industrial and textile coatings Features Resists UV degradation... [Pg.1155]

Uses Crosslinking agent for peroxide-cured rubber compds., irradiated coatings, polyesters, adhesives, concrete polymers, dental polymers, electronics, inks, plastisols, sealants Trade Names Bisomer E(2)BADMA Bisomer E30W Trade Names Containing Bisomer E(10)BADMA... [Pg.1246]

Uses Curing agent for radiation and peroxide cure systems incl. acrylics, adhesives (pressure sensitive, structural), coatings (glass, metal, optical, paper, PVC floor, release, textile, wood), concrete polymers, flooring, electronics (conformal, photoresists, solder masks), inks (flexo, gravure, litho, screen), paints, photopolymers Trade Names SR 454 SR 454HP... [Pg.1262]

The basic chemical reactions, used to synthesize monomer and polymer resins and the chemistry involved in the use of curing agents to polymerize the resins, have been extensively studied and are well documented. This section serves as a summary only of those polymers that are primarily used in adhesives formulations for electronic applications. Among these polymers are the epoxies, silicones, polyurethanes, polyimides, acrylates, cyanate esters, and cyclo-olefins. Further technical detail for these polymers maybe acquired through literature searches in the transactions of the American Chemical Society (Polymer Group), Society of Plastics Engineers (SPE), and the Society for the Advancement of Materials and Process Engineers (SAMPE). [Pg.96]

See other pages where Curing electronics adhesives agents is mentioned: [Pg.1]    [Pg.179]    [Pg.87]    [Pg.365]    [Pg.415]    [Pg.428]    [Pg.1034]    [Pg.49]    [Pg.54]    [Pg.578]    [Pg.365]    [Pg.261]    [Pg.607]    [Pg.179]    [Pg.130]    [Pg.254]    [Pg.657]    [Pg.1123]    [Pg.300]    [Pg.136]    [Pg.179]    [Pg.560]    [Pg.87]    [Pg.365]    [Pg.77]    [Pg.122]    [Pg.294]    [Pg.23]    [Pg.131]    [Pg.644]    [Pg.992]    [Pg.1002]    [Pg.1270]    [Pg.1328]    [Pg.1401]    [Pg.454]    [Pg.553]    [Pg.3301]    [Pg.3795]    [Pg.15]   
See also in sourсe #XX -- [ Pg.264 ]



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