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Creep Delamination

Solid A Solid B S/S Corrosion, grain boundary passivation, adhesion, delamination, epitaxial growth, nucleation and growth abrasion, wear, friction, diffusion, boundary structure thin films, solid state devices, mechanical stability, creep. [Pg.332]

In all types of materials, phenomena such as fracture, creep, segregation, roughening, and delamination ultimately determine the utility of a material for a... [Pg.34]

There is research underway to produce compatibilized blends of kenaf and jute with polypropylene. This research is directed at developing the technologies needed to combine dissimilar resources for improved bonding, impact resistance, moldability, and to decrease creep. The two materials remain as separate phases, but if delamination and/or void formation can be avoided, properties can be improved over those of either separate phase. [Pg.240]

TMS 2seem TMS+ 4seem H2, SOW, 2min, 50 mtorr A scribe creep width more than 7 mm was considered as a total delamination. [Pg.728]

A scribe creep width more than 7 mm was considered as a total delamination. [Pg.731]

The industrial partner was able to produce several adhesive layers with the required mechanical properties. There was a need to select a limited number of the adhesive layers for ftrrther tests. The selection was done based on creep and delamination tests. [Pg.108]

Target values for the required mechanical strength and the deformation behaviour of the adhesive layer are derived. We describe how adhesive formulahons can be developed and tested for their potential application based on shear, delamination and creep tests. With a limited number of suitable adhesive systems, large scale bending tests were carried out to verify the theoretical predictions. A fully satisfactory behaviour of a single adhesive layer demonstrated the enhanced strength of the glulam beam. [Pg.109]

The main problem encountered in this study was the development of the new adhesives. Whilst the adhesive manufacturer was able to produce the load-bearing behaviour required by the elastic model, he was not quite able to fully attain the conditions required for the plastic model. The creep tests with small specimens as well as the delamination tests revealed many weaknesses. The final tests revealed that the new adhesive mixtures produced in small quantities in the laboratory could not yet be successfully reproduced in large quantities in factory conditions. Much work needs to be done before the new family of adhesives will attain the stability and reliability required for practical applications. [Pg.142]

The TMA is an easy-to-use analytical instrument that measures dimensional changes in a material as a function of temperature or time under a controlled atmosphere. Its main uses in research and QC include accurate determination of coefficient of linear expansion of plastic materials. It also is used to detect transitions in materials (e.g., glass transition temperature, softening and flow information, delamination temperature, creep and stress relaxation, and melting phenomena). A wide variety of measurement modes are available (expansion, penetration, flexure, dilatometry, and tension) for analysis of solids, powders, libers, and thin film samples. [Pg.36]

D-2559. Specification for Adhesives for Structural Laminated Wood Products for Use Under Exterior (Wet Use) Exposure Conditions. Sample beams, made under various assembly time extremes, are tested for (a) basic dry glueline shear strength and wood failure and (b) resistance of glueline to delamination after accelerated aging. It also requires testing the adhesive s diy creep resistance. Used in qualifying new adhesives for use in exterior laminated beams. [Pg.99]

FIGURE 15.5 The wear scars of (A) vitamin-E-diffused, irradiated UHMWPE and (B) conventional gamma-sterilized (inert) UHMWPE after 2 million cycles of delamination testing. While the deformation was due mostly to creep and was recoverable after melting for vitamin-E-diffused, irradiated UHMWPE (C), there was severe delamination and wear in conventional UHMWPE (D). [Pg.227]


See other pages where Creep Delamination is mentioned: [Pg.11]    [Pg.424]    [Pg.7]    [Pg.252]    [Pg.779]    [Pg.824]    [Pg.602]    [Pg.371]    [Pg.512]    [Pg.388]    [Pg.13]    [Pg.360]    [Pg.467]    [Pg.404]    [Pg.2491]    [Pg.31]    [Pg.346]    [Pg.479]    [Pg.27]    [Pg.14]    [Pg.141]    [Pg.24]    [Pg.471]    [Pg.4]    [Pg.125]   
See also in sourсe #XX -- [ Pg.479 , Pg.503 , Pg.515 ]




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