Corrosion passivation

Evans, U.R. (1937) Metallic Corrosion, Passivity and Protection (Edward Arnold, London), 2nd edition, 1945. 

Fig. 1.38(Equilibrium potential-pH diagram for the Cr-H20 system and (< ) potential-pH diagram showing zones of corrosion, passivity and immunity (after Pourbaix )... 

The scale of components in complex condensed matter often results in structures having a high surface-area-to-volume ratio. In these systems, interfacial effects can be very important. The interfaces between vapor and condensed phases and between two condensed phases have been well studied over the past four decades. These studies have contributed to technologies from electronic materials and devices, to corrosion passivation, to heterogeneous catalysis. In recent years, the focus has broadened to include the interfaces between vapors, liquids, or solids and self-assembled structures of organic, biological, and polymeric nature. 

Solid-solid Adhesion Solid suspension, adhesion, cohesion, corrosion, passivation, epitaxial growth, wear, friction, diffusion, thin films, delamination, creep, mechanical stability, durability, solid state devices, blend and alloy, charge transfer, nucleation and growth abrasion... 

In usual polar aprotic solvents, all active metals (e.g., Li, Mg, Ca, and Al) are covered with surface films due to the reduction of solution components by the active metal and the consequent precipitation of insoluble species, but in the above molten salts these corrosion/passivation phenomena may be much less pronounced. Thus, deposition of divalent metals such as magnesium and calcium, which is not possible in usual polar aprotic systems because of the surface film barrier, may be feasible in electrolyte systems based on these molten salts. 

Figure 1.10 Pourbaix diagram for iron in terms of corrosion, passivity and immunity...

Copper, being a noble metal, has good resistance to corrosion. A thin adherent film of cuprous oxide and cupric carbonate is formed due to corrosion. Passivation is not a prominent process. The dissolved copper in solution affects the electrode potential such that the increase in velocity of the solution in contact with the metal results in increasing attack of the metal. Thus cuprous oxide is produced under dynamic flow of the solution. The thickness of the oxide film is about 500 nm. 

Hackerman was a leader in the field of -> corrosion, -> passivity, and surface chemistry at electrodes and metals. He was especially active in the field of -> corrosion inhibitors and establishing a molecular basis for their action. Hackerman promoted science at the federal and state levels through many activities, such as the National Science Board (1968-80 chair 1975-80). He was also active in the Electrochemical Society, serving as president (1957-58) and editor of the Journal of the Electrochemical Society (1969-89). He was elected to membership in a number of societies, including the National Academy of Sciences (1971), the American Philosophi-... 

U. R. Evans, Metallic Corrosion Passivity and Protection, Longmans, Green and Co., 1948. 

Abshere T. A. and Richmond G. L. (2000), Corrosion, passivation, and the effect of water addition on an n-GaAs(100)/methanol photoelectrochemical cell , J. Phys. Chem. B 104, 1602-1609. 

During the last few years many studies of the behaviour of sulfur on and with metallic surfaces have been published and have provided a more complete understanding of the interaction processes. They have included gas adsorption and desorption kinetics, surface and grain boundary segregation, embrittlement, sulfidation, corrosion, passivation, catalyst poisoning, among others. 

Interfacial structure The role of electrochemical phenomena at interfaces between ionic, electronic, photonic, and dielectric materials is reviewed. Also reviewed are opportunities for research concerning microstructure of solid surfaces, the influence of the electric field on electrochemical processes, surface films including corrosion passivity, electrocatalysis and adsorption, the evolution of surface shape, and self-assembly in supramolecular domains. 

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