Conclusion and Book Outline

In order to decrease the cost and delay impacts of the interconnect layers, new materials and processing schemes must be chosen to decrease processing complexity, defect density, and inter- 

F ure 1.1 Showing the materials and tool sets required fw complete CMP- process integration.  

This book attempts to strike a balance between fundamental understanding and practical application of CMP. We believe that a fundamental understanding of CMP is critical to the success of CMP in practice. 

Oldham, Proc. 5th VMIC IEEE, Santa Clara, CA, Cat. No. 88CH2624-5, IEEE, 

Martinez, paper presented at the SRC Topical Research Conference on Chemical Mechanica Mechanical Polishing held at Rensselaer Polytechnic Institute, Troy, NY, July 26-27 (1995), Proc. available from Semiconductor Research Corporation, Research Triangle Park, NC. 

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