CMP Slurry Stability and Correlation with Defectivity

We have also conducted adhesion measurements between real CMP abrasive particles (not model particles) and various surfaces as well as particle hardness and elastic modulus measurements, using colloidal AFM and nanoindentation AFM, respectively, in an attempt to correlate CMP defectivity with mechanical and adhesion properties of CMP abrasives [77,78]. For example, in a carefully designed experiment, we have been able to demonstrate that softer particles, indeed, result in fewer scratches [78]. [Pg.51]

As measurements on the dynamic properties of slurries and pads are important, can you list all analytical techniques you know or are familiar with that can be implemented in a CMP system [Pg.51]

Referring to question 1, what would be the advantages and limitations of your techniques, considering the possible interference from mechanical movements and chemical reactions [Pg.51]

What are the major challenges of introducing or implementing new consumable materials into an existing CMP process [Pg.52]

What are the general guidelines for selecting consumable materials for a new CMP process [Pg.52]

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