Chip metallization

CVD copper is competing directly with sputtering which, at this stage, is still the preferred production process. The semiconductor industry is shifting massively from aluminum to copper for chip metallization. 

In PDMS chips, metal electrodes cannot easily be made on PDMS because of its pliable nature. So the Au/Cr microband electrodes have first been formed on a glass plate, which was then aligned and sealed with a PDMS channel plate [748],... 

Thin-film (deposited) MCMs (MCM-D) are based on chip metalization processes. MCM-Ds have very fine feature sizes, giving high wiring densities (Fig. 8.115). MCM-Ds are made one layer at a time. 

Because of the thermal contraction mismatch of a silicon chip, metal lead-frame and silica-filled epoxy molding compound integrated circuit (IC) packages bow or warp when cooled to room temperature after manufacture. The magnitude of the bow in an IC package can be determined quantitatively by... 

Metal vapor degreasing is an important process in industrial manufacture, used to remove oils and oil-borne soils (i.e., chips, metal fines, and fluxes) from objects that have been stamped, machined, welded, soldered, molded, or diecast. Vapor degreased parts vary from tiny transistors to aircraft and spacecraft assemblies. 

Solder, copper conductors, and plated-copper cotmectors constitute the m or metallic components of second-level packaging for functional electronic circuits. These metals are all susceptible to corrosion. Typically, intercormects are less protected and more erqrosed to ambient enviromnents. However, their dimensions are much larger than those of chip metallization and more corrosion can therefore be tolerated before failme is produced. 

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