Chip-connection methods

Figure 1.6 Cross-sections of basic die bonding and chip-connection methods.

The microfluidic structure was manufactured in glass by classical photolithography and wet-chemical HF etching methods [164], Holes for fluid connection were drilled. A polymer membrane was prepared in-house and served as a top plate to give a glass-polymer sandwich chip. Pressure sealing was applied. 

A detector chip 10 of HgCdTe comprising detector elements 11 is connected via bumps 13 to bent buffers 17 of gold. The buffers 17 are in turn connected to input regions 15 of a CCD formed in a silicon substrate 14. A method to form the buffers is also provided. 

Microdielectrometry was introduced as a research method in 1981 14 and became commercially available in 1983 20). The microdielectrometry instrumentation combines the pair of field-effect transistors on the sensor chip (see Sect. 2.2.3) with external electronics to measure the transfer function H(co) of Eq. (2-18). Because the transistors on the sensor chip function as the input amplifier to the meter, cable admittance and shielding problems are greatly reduced. In addition, the use of a charge measurement rather than the admittance measurement allows the measurements to be made at arbitrarily low frequencies. As a matter of practice, reaction rates in cure studies limits the lowest useful frequency to about 0.1 Hz however, pre-cure or post-cure studies can be made to as low as 0.005 Hz. Finally, the differential connection used for the two transistors provides first-order cancellation of the effects of temperature and pressure on the transistor operation. The devices can be used for cure measurements to 300 °C, and at pressures to 200 psi. 

The ability to fill a device with many different fluids in different channels and chambers allows for the implementation of a simple and robust geometric method of metering solutions. The principle behind this scheme is to set up a geometry in which two microfluidic chambers may be primed with different solutions and connected via a fluidic interface that is controlled by a microfabricated valve (Fig. 11.4). With a central interface valve closed, the two chambers are first deadend filled with two different solutions using the POP technique. Once both chambers have been completely filled, containment valves are actuated, isolating the chambers from the rest of the chip. The interface valve is then opened, creating a... 

The photodiode array detector is connected to a computer fitted with a suitable package to control the method, calculate and report the results. The photodiode array detector consists of 1000 or more silicon photodiodes arranged side by side on a single small silicon chip and absorption of electromagnetic radiation by a pn-junction causes promotion of electrons from the valence bands to the conduction bands and thus the... 

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