Chemical polishing, definition

The enormous scope of the subject of corrosion follows from the definition which has been adopted in the present work. Corrosion will include all reactions at a metal/environment interface irrespective of whether the reaction is beneficial or detrimental to the metal concerned —no distinction is made between chemical or electropolishing of a metal in an acid and the adventitious deterioration of metal plant by acid attack. It follows, therefore, that a comprehensive work on the subject of corrosion should include an account of batteries, electrorefining, chemical machining, chemical and electrochemical polishing, etc. 

Patentable inventions must be useful, "reduced to practice" (35 USC, 102) and, by legal definition in most countries, also amenable to an industrial application. The German concept of a patentable invention describes it as "Lehre zum technischen Handeln" (teaching of a technical operation). The Polish law even requires a strictly technical character of the invention and currently excludes from patentability any biological product as well as pharmaceuticals and chemicals, even if these derive from a technical process. The technical process which is used to make such products, however, is patentable in almost all countries, irrespective of whether these refuse to grant patents on certain or all products of nature. 

Michal Ksawery Cyrailski was born in Warsaw, Poland (1970). In 1994 received his M.Sc. degree and in 1999 his Ph.D. degree, both at the Chemistry Department of Warsaw University. In 1997 he was a holder of the Foundation for Polish Science grant in 1998 he received the distinction of the Kemula Reward (by the Polish Chemical Society) and in 1999 the Kolos Reward for the best Ph.D. work (by the Department of Chemistry of Warsaw University). In 1998-2000 he was a secretary of the Executive Committee of the Polish Chemical Society (elected). His main scientific interests are the structural chemistry of small organic compounds, crystallochemistry, molecular modeling (ab initio), structural aspects of aromatic character of r-electron systems, and definition of aromaticity. So far, he has published over 30 original papers and 5 reviews and presented 5 lectures and over 30 poster and oral communications. His hobby is classical music, especially by J. S. Bach, and singing in a professional choir. 

By its virtue, chemical mechanical planarization (CMP) is a subtractive manufacturing process that polishes off overburden material as exemplified in Figure 17.3. So, naturally, once finished, it will reveal all the feamres underneath, circuits and defects alike. Also, in the semiconductor process flow, CMP is usually the terminal downstream process that completes the definition of a device or circuit. As a consequence, not only does it generate defects of its own, but it can also modulate defects from upstream processes. Therefore, the post-CMP defect target is usually the most stringent along the entire process flow because at this stage, defects have the most direct impacts on yield and reliability. 

---