Cap layers

Thermoformed chassis and body panels are featured on the car. The products were made initially in the USA for assembly in China. The car will weigh less than 2000 lb (900 kg). Automotive Design Composites, Inc of San Antonio, TX, designed the vehicle to have body panels and trunk formed from coextruded sheet of ABS with an ASA cap layer that will hang on a pultruded composite frame. Ceramic tooling is used to thermoform plastic products. 

The chassis is made from a 1/4 in. sheet of either ABS or TPO vacuum formed into a tub and reinforced with reinforced pultruded glass fiber-TS polyester plastic tubing. The hood and other products are being made from a 20 mm thick sandwich of thermo-formed PPO-alloy skins, glass fabric infused with thermosetting vinyl ester, and a urethane foam core. The bumper and front fascia is thermoformed from a polyolefin elastomer sheet with an UV-resistant cap layer of DuPont s Tediar PVF film. The dash and... 

Cap layer It is a plastic product that is topped or capped with another plastic. 

Organic electroluminescent device with stabilizing cathode capping layer... 

The stracture consists of a thin In Gaj- As layer grown epitaxially onto GaAs and covered with a GaAs cap layer. We know that the cap layer is about 1000 A thick and that the In Gai As layer is about 20A thick. The experimental rocking curve was taken with CuK i radiation in the symmetric 004 reflection, so we can immediately estimate the In composition assuming that... 

The high frequency fringe period corresponds to the combined thickness of both layers, or possibly the thickness of the capping layer. Assuming the latter, and measuring the fringe period p to be 120 arcsec, gives from... 

Carbon dioxide gas was used as a physical blowing agent to produce medium density polypropylene foam sheets using a single screw extruder. The mechanical properties of the foam were similar in the machine direction and in the transverse direction. Abetter surface finish and a lower density was produced by using a commercial wrapping film as a cap layer. The process conditions and the die design data are presented and an attempt made to relate them to the product characteristics. 4 refs. 

TiN film of approximately 300 A is typically used in the back-end interconnect process, as both the cap layer for the aluminum metal deposition sequence and an antireflective coating for the subsequent photolithography step. Since this TiN cannot be a substrate for oxide thickness measurement in ILD, the aluminum beneath the TiN must be used as the substrate. In other words, the TiN is a component of the film to be measured. Thus, its refractive index or thickness must be known to determine the unknown oxide thickness. However, the refractive index of TiN is not constant, but varies with thickness. As a result, the TiN thickness must be precisely controlled to enable the validity of the substrate modeling. 

If the LbL film has relatively high thickness, the release rate can be driven by molecule diffusion through the film. Schneider demonstrated that drug diffusion through the film proceeds for several hours, as achieved by placement of the CHI/HA film loaded with diclofenac and paclitaxel in 0.15 M NaCl (pH 7.4) into phosphate-buffered saline solution. Vodouhe showed that the PLL/HA films passively loaded with taxol can regulate cell adhesion and viability by deposition of capping layers of PAH/PSS, which effects both drug release and cell adhesion [57],... 

The imager of EP-A-0406696 is made up of a compositionally graded p-type base layer and a compositionally graded cap layer in which pn-junctions are formed. The structure has a small amount of leakage current and a large diode impedance. 

Infrared radiation is incident on and passes through a substrate 12. The radiation is absorbed within an n-type absorbing layer 14a. The n-type layer is overlied by a p-type layer. The n-type layer and the p-type layer are divided into mesa structures 16, which have sub-mesa structures 16a and 16b each containing a portion of the p-type layer as a p-type cap layer 14b. Trenches 30 are etched or milled to a depth that extends completely through the p-type cap layer and partially into the n-type layer. The trench width is approximately 10 microns. Trench walls 32... 

The imager of US-A-5177580 (Santa Barbara Research Center, USA, 05.01.93) refers to a mesa-type photodiode array having U-shaped channels formed through an n-type capping layer, a p-type radiation absorbing base layer and partially into an underlying p-type buffer layer of the type presented in WO-A-8707083. The inherently imprecise nature of the chemical... 

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