Bonded Compliant Seal Concept

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In the same year, Weil et al. [13] introduced a sealing concept for planar SOFCs. The finite element method (FEM) was used to aid in scaling up a bonded compliant sealant design to a 120 x 120 mm component. The stresses of the cell, foil, brazes, and frame were calculated and compared with experimental fracture and yield stress results. A quarter symmetrical model was used. The commercial software AN SYS was utilized. The tensile stress of the component was predicted, considering thermal cycling from elevated temperature to room temperature. The materials used were mentioned, but no properties were given. Regarding the structural analysis boundary conditions and the failure criteria employed, material models were not depicted. 

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