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Bisphenol thermal expansion

The fluorine content, density, critical surface energy, glass transitions, thermal expansion coefficient above and below the glass transition, and 300°C isothermal thermogravimetric stabilities of the fluoromethylene cyanate ester resin system with n = 3, 4, 6, 8, 10 are summarized Table 2.2. Also included for the purpose of comparison are the corresponding data for the aromatic cyanate ester resin based on the dicyanate of 6F bisphenol A (AroCy F, Ciba Geigy). [Pg.32]

Thermal mechanical analysis was utilized by Ophir 174) to study the densification of Bisphenol-A-based epoxies. The glass transition temperature can easily be characterized by a slope change as the resin transits from the glassy state to the rubbery state (see Fig. 25). Hence, in glassy material, it is typically represented by two thermal expansivity parameters, one below T (glassy thermal expansivity) and one... [Pg.147]

We have investigated the recovered glassfiber-resin powder for its properties as a filler for epoxy resin compounds which are used as paints or adhesives, and compared it to conventional fillers, such as talc and calcium carbonate. The epoxy resin compound, composed of bisphenol A type epoxy resin (50.0wt%), aliphatic polyamine type hardener (18.0wt%) and filler (32.0%), was prepared. Strength and thermal expansion properties were measured for the molded epoxy resin compound cured 23°C for 7 days. Viscosity was measured for the epoxy resin compound before adding the hardener. Adhesive strength was measured by tearing two ferric boards bonded with the epoxy resin compound which was composed of bisphenol A type epoxy resin (49.2wt%), polyaminoamide type hardener (18.0wt %), and filler (32.8wt%), and was cured at 23°C for 7 days. [Pg.94]

Dutta et al. [16] reported the thermal expansion in prepreg film and crossply laminates of prepreg films. The films were prepared from a blend containing 10 wt% of thermotropic LC copolyester (Vectra A950) and 90 wt% polycarbonate (General Electric Corporation bisphenol-A polycarbonate, PC2). The highest order parameter of the PLC phase L57 (s = 0.45) was obtained at a draw ratio of the film 7.6. [Pg.243]

Because of excessive shrinkage (about 5%), a high coefficient of thermal expansion, and poor abrasion resistance, these materials were replaced by a series of composite materials based on a fundamental patent by Bowen.The polymer portion was a single, densely crosslinked network formed by polymerizing the reaction product of glycidyl methacrylate with bisphenol A. The monomer, known as bis-GMA, had the structure... [Pg.215]


See other pages where Bisphenol thermal expansion is mentioned: [Pg.154]    [Pg.49]    [Pg.49]    [Pg.51]    [Pg.54]    [Pg.201]    [Pg.64]    [Pg.364]    [Pg.34]    [Pg.2194]    [Pg.8501]    [Pg.180]    [Pg.272]    [Pg.150]    [Pg.321]    [Pg.129]    [Pg.156]    [Pg.360]    [Pg.156]   
See also in sourсe #XX -- [ Pg.293 ]




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