Bisphenol curing agents

Resin-curing systems Soap/sulfur systems Urethane crosslinking agents Bisphenol curing agents... 

Process Raw Material. Industrial solvents are raw materials in some production processes. Eor example, only a small proportion of acetone is used as a solvent, most is used in producing methyl methacrylate and bisphenol A. Alcohols are used in the manufacture of esters and glycol ethers. Diethylenetriamine is also used in the manufacture of curing agents for epoxy resins. Traditionally, chlorinated hydrocarbon solvents have been the starting materials for duorinated hydrocarbon production. 

Curing Systems. The most commonly used vulcanizing agent for the polyethers not containing AGE, that is, ECH and ECH—EO, is 2-mercaptoimidazoline, also called ethylenethiourea [96-45-7]. Other commercially appHed curing agents include derivatives of 2,5-dimercapto-l,3,4-thiadiazole, trithiocyanuric acid and derivatives, bisphenols, diamines, and other substituted thioureas. 

The outstanding performance characteristics of the resins are conveyed by the bisphenol A moiety (toughness, rigidity, and elevated temperature performance), the ether linkages (chemical resistance), and the hydroxyl and epoxy groups (adhesive properties and formulation latitude, or reactivity with a wide variety of chemical curing agents) (see also Phenolic resins). 

The cycloahphatic products are generally Hquids of lower viscosity than the standard glycidyl ether resins. The peroxidized resins contain no chlorine and low ash content and their ring-contained oxirane group (cyclohexene oxide type) reacts more readily with acidic curing agents than the bisphenol A-derived epoxy resins. 

Epichlorohydrin with bisphenol A. The curing agents may pose significant health hazards, e.g. amines (triethylamine, p-phenylenediamine, diethylenetriamine) or acid anhydrides (pyromellitic dianhydride)... 

A cement slurry additive consisting of methylcellulose, melamine-formaldehyde resin, and trioxane has been proposed for better bonding of cement to the casing string [20]. Bisphenol-A epoxide resins, with amine-based curing agents, sand filler, and a mixture of n-butanol and dimethyl benzene as a diluent, have been proposed as additives to increase adhesion properties of cement [572]. 

Epoxy resins. The reaction of Bisphenol A and epichlorohydrin gives a low molecular weight linear polymer. This polymer further reacts with an amine-curing agent, R-NH2, to give a general-purpose thermoset. See Figure 24-2.) Now that s not as complicated as it sounds. First of all, you d think... 

Figure 2. Solid-state spectra of four different epoxies (hosed on the resin diglycidyl ether of bisphenol-A) are compared with the liquid-state spectra of their respective unreacted components, The chemical compositions are in Table I. Here the epoxies are identified by their main curing agent (a) PIP—piperidine (b) MPDA—metaphenylene diamine (c) HHPA—hexahydro-phthalic anhydride (d) NMA—nadic methyl anhydride.

Diglycidyl ether of bisphenol-A (DGEBA), epoxy resin (YD 128, Kuk Do Chem., Mn = 378), and bisphenol-A dicyanate (BPACY, Arocy B-10, Ciba-Geigy) were used as the thermoset resin. 4,4 -diaminodiphenyl sulfone (DDS, Aldrich Chem. Co.) was used as a curing agent for epoxy. Polyetherimide (PEI, Ultem 1000, General Electric Co., M = 18,000) and 2-methyl imidazole (2MZ, Aldrich Chem. Co.) were used as the thermoplastic modifier and catalyst. 

CA 62, 395(1965) [A castable expl compn provided by curing a mixture contg 50—80% powdered hydrazine nitrate, 13—40% binder (such as a polyester of mol wt 500—5000 derived from polyhydric ales and polybasic acids), and 3—10% curing agent (such as a diglycidyl ether of bisphenol A or.F), powd metals (such as Mg, Al, Ti, etc) 5—15%, and minor propns... 

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