Bisphenol A Diglycidyl Ether curing

FIGURE 6.2 Effect of solvent type on the pot life of a hydrogenated bisphenol A diglycidyl ether cured with a polyamide.5... 

Table 8.10. Effect of fillers on shrinkage in the polymerization of bisphenol A diglycidyl ether cured with primary amines 441...

Norman Grassie, Marilyn I Guy, Norman H Teiment. Degradation of epoxy polymers part 4—thermal degradation of bisphenol-A diglycidyl ether cured with ethylene diamine. Polymer Degradation and Stability, 14(2) 125-137,1986. 

The term epoxy is familiar to nonchemists because of the widespread use of epoxy glues and resins. These are crosslinked polyether thermoplastics made from a liquid resin which is typically a mixture of bisphenol A diglycidyl ether (70) and a polymer (71 Scheme 86). The liquid resin is cured or hardened to the final resin by mixing with a crosslinking reagent, which can be an acid, a di- or poly-alcohol, or a di- or poly-amine (Scheme 86). 

Preparation of a Cured Epoxy Resin by the Room Temperature Reaction of Bisphenol A Diglycidyl Ether with Polyamines... 

Acitelli, M. A., Prime, R. B., Sacher, E. Kinetic of epoxy cure (1) the system Bisphenol-A diglycidyl ether/m-phenylenediamine, Polymer, 12, 335 (1971)... 

Figure 15.2 (a) Bisphenol A diglycidyl ether, (b) Curing reaction on an epoxy resin with a diamine. 

The presence of accelerators, either magnesium perchloroate or N,N-dimethylbenzylamine (DMBA) [29], on the curing of bisphenol A diglycidyl ether with butane-1,4-diol (BADGE-BD) were studied by CP/MAS (Fig. 15.2.31). Magnesium perchlorate was shown to induce the consumption of all the diol whereas the DMBA showed only approximately 50% consumption... 

Model formulation 70 parts of bisphenol A diglycidyl ether (5.4 mol epoxy/kg), 5 parts of butane-1,-4-dioldiglycidyl ether, 0.1 part of glycidyloxypropyltrimethoxysilane, 30 parts of Wollastonit PI filler, 9.8 parts of dicyandiamide, 0.5 part of chlorotolurone accelerator, 0.1 part of Aerosil 380 ETBN contents were 5,15,20, 30, and 70 parts cure 1 h at 80 °C. rNot determined. 

Figure 8. TEM image of dicyandiamide-cured bisphenol A diglycidyl ether containing 28 wt% ETBN (left) and a blend of 14 wt% ETBN and 14 wt% PPU (right).

Structure-Property Relations of Polyethertriamine-Cured Bisphenol-A-diglycidyl Ether Epoxies... 

The effect of concentration of reactive diluent, namely, 1, 6-hexanediol diacrylate (HDDA), on the EB curing behavior and some of the important properties of the coatings based on bisphenol A diglycidyl ether diacrylate resin (BDGDA) have been investigated and presented in this section (Kumar et al. 2006). 

Kumar, V, Bhardwaj, YK, Goel, NK, Francis, S, Sarma, KSS, Dubey, KA, Chaudhari, CV, Sabharwal, S. 2008. Coating characteristics of electron beam cured bisphenol A diglycidyl ether diaciylate resin-co-aliphatic urethane acrylate resins. Surf Coat Technol 202 5202-5209. 

The curing reaction of a DICY-based epoxy resin was characterized by DSC. The epoxy resin was composed of a mixture of brominated bisphenol-A diglycidyl ether and of epoxidized cresol novolak with dicyandiamide (DICY) as hardener and tetramethyl butane diamine (TMBDA) as catalyst. The optimum ratio of epoxy/ DICY in terms of the glass transiticii temperature (Tg) was determined to be about 8 1. It could be shown that the heat of reaction (AH) at B-stage is strongly dependent on the amount of unreacted DICY. It was observed that for the optimum formulation, Tg increased linearly with conversion Cor AH) up to 95% conversion. 

Epoxide resins contain the characteristic oxirane structure which can be converted to cross-linked structures in what is known as the curing or hardening reaction. More than 85% of the world production of epoxide resins consists of the bisphenol-A-diglycidyl ether, also known as 2,2-bis(p-glycidyloxyphenyl)propane, which has the idealized structure... 

The resin, (Bisphenol A diglycidyl ether with an acid anhydride curing agent for formulation see Table II) is metered, hand stirred, and vacuum degassed at a pressure of 20 Pa prior to transfer into a separate vacuum chamber (G), which is at a pressure of less than 10 Pa. 

Residual monomers of epoxy resins (i.e., m-xylylenediamine and bisphenol A diglycidyl ether) were extracted from cured epoxy resins and analyzed on a C g column (A = 275 nm, ex 300 nm, em for m-xylylenediamine) using a complex 20-min 30/70 -> 75/25 acetonitrile/water gradient [1019]. Excellent resolution of bisphenol F, bisphenol A, three bisphenol F diglycidyl ether isomers, and bisphenol A diglycidyl ether resulted. Peak sh s were also excellent. Linear concentration curves from 20 to 1000 pg/L were obtained. The m-xylylenediamine was derivatized with fluorescamine and analyzed with the same column and gradient as for bisphenol (but with different excitation/emission wavelengths) and linear curves from 10-800 pg/L were obtained. 

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