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Binder laminates with various

Figure 4.11 Comparison of flexural strengths of CSM laminates with various binders (Sundaram). Figure 4.11 Comparison of flexural strengths of CSM laminates with various binders (Sundaram).
As an additional component, various thermoplastic polymers can be used. As a binder for copper clad laminates, a solution of solid epoxide resin (Epikote 1001), BPA/DC prepolymer, Zn acetate and poly(phenylene sulfide) was used [83], Other binders for reinforced plastics contain polysulfone. Such compositions consist of liquid BPA/ECH epoxide resin, BPA/DC prepolymer, polysulfone and bis(4-hydro-xyphenyl)sulfone [85]. Bis(4-aminophenyl)sulfone can be also added [86]. In such systems the bisphenol reacts with the epoxide resin as a chain extension agent, whereas the diamine crosslinks the diepoxide. The Tg values are close to 200 °C. They can be increased a little, if the BPA/ECH epoxide resin is replaced by the tetra-epoxide A,A,A, A -tetrakis(2,3-epoxypropyl)diaminodiphenylmethane [87]. [Pg.52]

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Laminates binders

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