Autocatalytic plating process

Electroless Electrolytic Plating. In electroless or autocatalytic plating, no external voltage/current source is required (21). The voltage/current is suppHed by the chemical reduction of an agent at the deposit surface. The reduction reaction must be catalyzed, and often boron or phosphoms is used as the catalyst. Materials that are commonly deposited by electroless plating (qv) are Ni, Cu, Au, Pd, Pt, Ag, Co, and Ni—Fe (permalloy). In order to initiate the electroless deposition process, a catalyst must be present on the surface. A common catalyst for electroless nickel is tin. Often an accelerator is needed to remove the protective coat on the catalysis and start the reaction. 

The activation of nonconducting materials by the deposition of metal-containing polymer films could improve the autocatalytic metallization process by eliminating the aqueous etching and sensitizing steps. In addition, substrates that are hard to etch and activate by the aqueous process could be plated by this technique. 

Typically, before Ni coating on Al, a zincation pretreatment of the A1 is essential to enhance the Al-Ni interfacial contact, acting as a sacrificial layer during the autocatalytic electroless nickel plating process [3], This paper focuses on the zincation treatments for electroless nickel plating by analyzing the surface morphology and the deposited Ni properties. 

During electroless plating, metal is deposited onto the desired surface from solution through an autocatalytic redox process [36]. Specifically, a reductant in the... 

The most popular electroless nickel plating process is the one in which hypophosphite is used as the reducer. Autocatalytic nickel ion reduction by hypo-phosphite takes place in both acid and alkaline solutions. In a stable solution with a high coating quality, the deposition rate may be as high as 20-25 p,m/h. However, a relatively high temperature of 194°F/90°C is required. Since hydrogen ions are formed in the reduction reaction,... 

You are to pultrude a thin fiber reinforced epoxy plate at arate of lcm/s. Assume kinetic properties given in the last two problems and that the material is best represented with the autocatalytic second order reaction kinetic model of the previous problem. You are asked to design the die and the process to manufacture this product. 

Electroless plating — An autocatalytic process of metal deposition on a substrate by reduction of metal ions from solution without using an external source of electrons. It is promoted by specific reductants, namely formaldehyde, sodium hypophosphide, sodium boro-hydride, dialkylamine borane, and hydrazine. Electroless deposition has been used to produce different metal (e.g., nickel, cobalt, copper, gold, platinum, palladium, silver) and alloy coatings. It can be applied to any type of substrate including non-conductors. Some substrates are intrinsic catalytic for the electroless deposition other can be catalyzed usually by sensibilization followed by Pd nucleation also, in some non-catalytic metallic substrates the electroless process can be induced by an initial application of an appropriate potential pulse. In practical terms, the evaluation of the catalytic activity of a substrate for the electroless deposition of a given metal is... 

Pre-seeded palladium nuclei at the activation stage reduce the induction period of the autocatalytic process at the beginning of the deposition. The composition of a typical Pd plating solution is shown in Table 13.1 [7]. 

Autocatalytic deposition is the most widely used type of plating of metals from aqueous solutions, without an application of the external electrical current or potential. This process is frequently called electroless or chemical deposition, although, these terms do not precisely describe the autocatalytic deposition. 

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