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Silicon antimony

Thompson and Tracy carried out tests in a moist ammoniacal atmosphere on stressed binary copper alloys containing zinc, phosphorus, arsenic, antimony, silicon, nickel or aluminium. All these elements gave alloys susceptible to stress corrosion. In the case of zinc the breaking time decreased steadily with increase of zinc content, but with most of the other elements there was a minimum in the curve of content of alloying elements against breaking time. In tests carried out at almost 70MN/m these minima occurred with about 0-2% P, 0-2% As, 1% Si, 5% Ni and 1% Al. In most cases cracks were intercrystalline. [Pg.707]

Analysis of discharge particles revealed that both spherical and irregular particles were present, with approximately 1 in 12 spherical. The particle size range was from 3 to 160 pm. The elements detected were aluminum, calcium, chlorine, copper, iron, potassium, magnesium, phosphorus, lead, sulfur, antimony, silicon, titanium, and zinc, with calcium, chlorine, potassium, phosphorus, lead, and silicon the major elements. Antimony and lead did not occur together and none of the samples examined would be confused with FDR particles as their elemental profile differed. A small proportion of the particles containing either lead or antimony met the criteria for single element FDR particles. [Pg.149]

Use these data to compute the activity coefficient of silicon in the antimony-silicon mixtures as a function of the liquid composition of silicon. [Pg.688]

Sellaite, see Magnesium fluoride Senarmontite, see Antimony(III) oxide Siderite, see Iron(II) carbonate Siderotil, see Iron(II) sulfate 5-water Silica, see Silicon dioxide Silicotungstic acid, see Silicon oxide—tungsten oxide—water (1/12/26)... [Pg.275]

Fig. 5. Bipolar transistor (a) schematic and (b) doping profiles of A, arsenic ion implanted into the silicon of the emitter ( -type) B, boron ion implanted into the silicon of the base (p-type) C, antimony ion implanted into the buried layer ( -type) and D, the epi layer... Fig. 5. Bipolar transistor (a) schematic and (b) doping profiles of A, arsenic ion implanted into the silicon of the emitter ( -type) B, boron ion implanted into the silicon of the base (p-type) C, antimony ion implanted into the buried layer ( -type) and D, the epi layer...
Many organic peroxides of metals have been hydrolyzed to alkyl hydroperoxides. The alkylperoxy derivatives of aluminum, antimony, arsenic, boron, cadmium, germanium, lead, magnesium, phosphoms, silicon, tin, and zinc yield alkyl hydroperoxides upon hydrolysis (10,33,60,61). [Pg.105]

Organomineral peroxides of antimony arsenic, boron, magnesium, tin, cadmium, lead, silicon, and 2inc have been prepared by autoxidation and some are Hsted in Table 3 (33,44,60,93,115). For example, dimethyl cadmium reacts with oxygen to form methylperoxy methyl cadmium [69331-62-0] and bis(methylperoxy) cadmium. [Pg.111]

The less common heteroatoms are those other than nitrogen, oxygen and sulfur (arid selenium and tellurium which are treated alongside sulfur), i.e. phosphorus, arsenic, antimony, bismuth, the halogens, silicon, germanium, tin, lead, boron and the transition metals. [Pg.2]

Alkyl silyl ethers are cleaved by a variety of reagents Whether the silicon-oxygen or the carbon-oxygen bond is cleaved depends on the nature of the reagent used Treatment of alkoxysilanes with electrophilic reagents like antimony tri-fluonde, 40% hydrofluonc acid, or a boron tnfluonde-ether complex results in the cleavage of the silicon-oxygen bond to form mono-, di-, and tnfluorosiloxanes or silanes [19, 20, 21) (equations 18-20)... [Pg.205]

Compounds where fluorine is bound directly to silicon may be prepared duectly from sihcon tetrafluonde, obtamed by treatment of sihcon tetrachlonde with antimony tnfluonde and an alkyUithium or hthium amide base [99, 100] (equauon 80)... [Pg.600]

Heating with the following solids, their fusions, or vapours (a) oxides, peroxides, hydroxides, nitrates, nitrites, sulphides, cyanides, hexacyano-ferrate(III), and hexacyanoferrate(II) of the alkali and alkaline-earth metals (except oxides and hydroxides of calcium and strontium) (b) molten lead, silver, copper, zinc, bismuth, tin, or gold, or mixtures which form these metals upon reduction (c) phosphorus, arsenic, antimony, or silicon, or mixtures which form these elements upon reduction, particularly phosphates, arsenates,... [Pg.95]

Which element of each of the following pairs has the higher electron affinity (a) aluminum or indium (b) bismuth or antimony (c) silicon or lead ... [Pg.178]

Identify the following elements as metals, nonmetals, or metalloids (a) lead (b) sulfur (c) zinc (d) silicon (e) antimony (f) cadmium. [Pg.178]

Boron nitride is one of the most outstanding corrosion-resistant materials. It is inert to gasoline, benzene, alcohol, acetone, chlorinated hydrocarbons and other organic solvents. It is not wetted by molten aluminum, copper, cadmium, iron, antimony, bismuth, silicon, germanium, nor by many molten salts and glasses. It is used extensively as crucible material, particularly for molten metals, glasses and ceramic processing. [Pg.442]

Six elements are metalloids B, Si, Ge, As, Sb, and Te. Of these, silicon is by far the most abundant, making up over 27% of the Earth s crust, more than any other element except oxygen, hi fact, S1O2 and silicate minerals account for 80% of the atoms near the Earth s surface. Despite its great abundance, silicon was not discovered until 1824, probably because the strong bonds it forms with oxygen makes silicon difficult to isolate. Two much rarer metalloids, antimony (known to the ancients) and arsenic (discovered ca. 1250 ad) were isolated and identified long before silicon. [Pg.1521]

From blister copper, residual sulfur and impurities such as aluminum, silicon, manganese, zinc, tin, iron, nickel, arsenic, antimony and lead are first eliminated by oxidation and slagging. At the end of this stage excess oxygen remains in the partly purified copper, and this is removed by a deoxidation process. [Pg.429]

Flame resistance A1203, antimony oxides, boron compounds, halogen compounds, phosphate esters, metal hydrates, magnesium compounds, tin compounds, molybdenum compounds, silicones Al, B, Br, Cl, Mo, P, Sb, Si, Sn, Zn... [Pg.587]

As mentioned above, approximately 7% of the total sulfur present in lead ore is emitted as S02. The remainder is captured by the blast furnace slag. The blast furnace slag is composed primarily of iron and silicon oxides, as well as aluminum and calcium oxides. Other metals may also be present in smaller amounts, including antimony, arsenic, beryllium, cadmium, chromium, cobalt, copper, lead, manganese, mercury, molybdenum, silver, and zinc. This blast furnace slag is either recycled back into the process or disposed of in piles on site. About 50 to 60% of the recovery furnace output is slag and residual lead, which are both returned to the blast furnace. The remainder of this dross furnace output is sold to copper smelters for recovery of the copper and other precious metals. [Pg.90]

Chlorine Trifluoride Tech. Bull. , Morristown, Baker Adamson, 1970 Incandescence is caused by contact with bromine, iodine, arsenic, antimony (even at -10°C) powdered molybdenum, niobium, tantalum, titanium, vanadium boron, carbon, phosphorus or sulfur [1], Carbon tetraiodide, chloromethane, benzene or ether ignite or explode on contact, as do organic materials generally. Silicon also ignites [2],... [Pg.103]

Antimony, bismuth, arsenic, boron, red phosphorus, silicon [1] and tin [2] all react with incandescence. [Pg.1509]

Contact with boron, silicon, red phosphorus, sulfur, or arsenic, antimony or bismuth usually causes incandescence [1]. Solid potassium or molten sodium explode with the pentafluoride, and aluminium foil ignites on prolonged contact [2], Molybdenum and tungsten incandesce when warmed [3],... [Pg.1538]


See other pages where Silicon antimony is mentioned: [Pg.284]    [Pg.2501]    [Pg.54]    [Pg.478]    [Pg.1]    [Pg.447]    [Pg.126]    [Pg.174]    [Pg.284]    [Pg.2501]    [Pg.54]    [Pg.478]    [Pg.1]    [Pg.447]    [Pg.126]    [Pg.174]    [Pg.2398]    [Pg.385]    [Pg.518]    [Pg.176]    [Pg.34]    [Pg.124]    [Pg.272]    [Pg.24]    [Pg.795]    [Pg.44]    [Pg.4]    [Pg.720]    [Pg.99]    [Pg.945]    [Pg.116]    [Pg.521]    [Pg.17]   
See also in sourсe #XX -- [ Pg.2 , Pg.4 , Pg.4 , Pg.4 , Pg.7 ]




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