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ANSI/J-STD

K flux is rated LO or LI in ANSI-J-Std-004 ff flux does not contain rosin or resin ff flux contains rosin or resin... [Pg.1023]

ANSI J-STD-004A, Requirements for Soldering Flnxes, available from the IPC. January 2004. [Pg.1024]

ANSI/J-STD-OOl, Requirements for Soldered Electrical and Electronic Assemblies. ... [Pg.1241]

ANSI/J-STD-002, Solderability Tests for Component I,eads, Terminations, Lugs, Terminals and Wires. ... [Pg.1241]

Solderability Tests for Printed Boards, Joint Industry Standard, EIA/IPC, ANSI/J-STD-003,... [Pg.691]

In 2003, a process qualification study was initiated with a test laboratory to qualify and validate the assembly process using Surface Insulation Resistance (SIR) electrical performance and Ion Chromatography testing on a test board. The study used IPC Class 3 level performance per IPC ANSI J-STD OOlC. The analysis was conducted using ionic cleanliness evaluation by Ion Chromatography IPC-TM-650, method 2.3.28 and SIR characterization IPC-TM-650, method 2.6.3.3A. [Pg.70]

All boards using current production and new process conditions with the vapor phase reflow passed IPC SIR criteria, meeting ANSI J-STD 001,... [Pg.72]

TABLE 5.4 Classification of Solder Pastes by Metal-Powder Particle Size (ANSI/J-STD-005) (DIN 32513-1)... [Pg.144]

Requirements for Soldering Fluxes, ANSI/J-STD-004, Amendment 1 IPC Lincolnwood, IL, April 1996. [Pg.208]

Klein Wassink, R.J. Soldering in Electronics, Electrochemical Publications Isle of Man, 1989 221 pp. Klein Wassink, R.J. Soldering in Electronics, Electrochemical Publications Isle of Man, 1989 210 pp. Joint Industry Standard (ANSI/J-STD-004), rev. August 23, 1999. [Pg.428]

IEEE Standard on Piezoelectricity (ANSI-IEEE Std 176-1978) (1978) IEEE, New York, NY IEEE Standard on Piezoelectricity (ANSI-IEEE Std 176-1987) (1987) IEEE, New York, NY IRE Standards on Piezoelectric Crystals (1949) Pioc. IRE 37(12) 1378-1395 Kittinger E, Tichy J, Bertagnolli E (1981) Example of a negative effective Poisson s ratio. Phys Rev Lett 47 712... [Pg.54]

Refer to Chap. 42 for detailed information on solderability of PCB surface finishes. Testing methods are contained in the comprehensive joint industry specification ANSI/IPC J-STD 003. Surface finishes are commonly tested in production at the board fabricator using a solder float or solder dip method. When qualifying the finish, an OEM or assembler uses more equipment-specific tests such as wetting balance, rotary dip, or paste spread methods. Solderability should be consistent from day to day and lot to lot, with very little degradation after exposure to at least three assembly thermal exposures. [Pg.764]

See other pages where ANSI/J-STD is mentioned: [Pg.990]    [Pg.1180]    [Pg.1190]    [Pg.1241]    [Pg.191]    [Pg.524]    [Pg.990]    [Pg.1180]    [Pg.1190]    [Pg.1241]    [Pg.191]    [Pg.524]    [Pg.321]    [Pg.380]    [Pg.708]   
See also in sourсe #XX -- [ Pg.2 , Pg.3 , Pg.4 , Pg.5 , Pg.42 , Pg.52 ]



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