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Computer-assisted alignment

The relative descriptor C(R, 0) provides a criterion with which to obtain the optimum molecular alignment. Although the problem of achieving a maximized alignment is encountered routinely in computer-assisted drug design, a completely satisfactory solution is elusive. Improved solutions have been stud-ied232-239 and continue to be developed. [Pg.238]

Picard, F., et al., Computer-assisted navigation for knee arthroplasty Intra-operative measurements of alignment and soft tissue balancing, in First Annual Meeting ofCAOS International, 2001, Davos, Switzerland. [Pg.780]

To assist the interpretation of family memberships, overall probability scores for both global and motif matches are provided for top hit families. The global score is computed from the BLAST e-value, the SSEARCH score, and the percentage of sequence identity at overlapped length ratio in SSEARCH alignment. The motif score is computed from the ratio of mismatched amino acids to ProSite patterns, and the hidden Markov motif match score. Family information from ProClass, with hypertext links to all other major family... [Pg.139]

We thank Volker Buchbender (University of Koblenz), Eberhard Fischer (University of Koblenz) and Andreas Solga (University of Bonn) for providing us fresh material of Cyathophorum africanum from Kenya. Special thanks are due to Conny Lohne (University of Bonn) for the introduction to the computer program WinClada and her assistance with the construction of Figure 4.26 and Pieter Pelser (Miami University, Oxford, Ohio) for his valuable comments on the manuscript. We very much appreciate the kind help by Dietmar Quandt (Technical University of Dresden), who provided us various DNA sequences and performed the alignment. [Pg.106]

This technique consists of directing a heated stream of air or other process gas such as nitrogen at the component to be removed. Modem hot-gas repair stations are sophisticated, with computer control, predictive reflow profiling, vision systems to assist in component alignment to bonding pads on the printed wiring board (PWB), preheating stations, and accommodations for component removal. Hot-gas repair is most often used for SMT components but can be adapted for PTH component removal. [Pg.1135]


See other pages where Computer-assisted alignment is mentioned: [Pg.193]    [Pg.222]    [Pg.161]    [Pg.48]    [Pg.8]    [Pg.69]    [Pg.503]    [Pg.135]    [Pg.160]    [Pg.428]    [Pg.217]    [Pg.603]    [Pg.182]    [Pg.34]    [Pg.21]    [Pg.78]    [Pg.1]    [Pg.294]    [Pg.2]    [Pg.1180]    [Pg.199]   
See also in sourсe #XX -- [ Pg.161 ]




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Computer assistance

Computer-assisted

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