Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Advanced packaging Multichip modules

Pautsch, G. and Bar-Cohen, A., 1999, Thermal Management of Multichip Modules with Evaporative Spray Cooling, ASME Publication, EEP-Vol 26-1, Advances in Electronic Packaging -1999, Vol 1, Proceedings, InterPack 99, Maui, Hawaii... [Pg.338]

The foremost trade magazine is Advanced Packaging, available free of charge to qualified subscribers. The two main technical conferences are (1) The IEEE Multichip Module Conference (MCMC), and (2) the ISHM/IEEE Multichip Module Conference. [Pg.844]

See other pages where Advanced packaging Multichip modules is mentioned: [Pg.187]    [Pg.62]    [Pg.187]    [Pg.480]    [Pg.139]    [Pg.187]    [Pg.173]    [Pg.79]    [Pg.1250]    [Pg.444]   
See also in sourсe #XX -- [ Pg.4 , Pg.4 , Pg.5 , Pg.6 , Pg.12 , Pg.13 , Pg.14 ]



SEARCH



Multichip

Multichip module package

© 2024 chempedia.info