Writing power dissipation

Contact a manufacturer of aluminum heal sinks and obtain their product catalog for cooling electronic components by natural convection and radiation. Write an essay on how to select a suitable heal sink for an electronic component when its maximum power dissipation and maximum allowable surface temperature are specified. 

We will now examine in more detail the frequency dependence of the power transmitted through the cavity into the load. From before, we write the power dissipated in the load, Pl,... 

PCs, with, e.g., 450 MHz processors not uncommon as of the date of this writing, has created severe demands not on the on-chip processing technology, but rather on the electrical interconnects between chip elements. Typical problems include crosstalk, power dissipation across distances and EMI shielding. Optical interconnections between electrical components, i.e. "E/0 interconnects", are one possible solution. Such E/0 interconnects can also be used in telephone and other telecommunication as interfaces between optical fibers. 

Heat dissipation occurs primarily by conduction, therefore organic materials having low thermal conductivities typically need less laser power for recording than other materials. Indeed, it has been found that a writing energy of just 0.1 nanojoule per square micron can give rise to a temperature rise sufficient to melt many plastics and dyes.196... 

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