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Vinyl pyridine-based resins

Most of the aramid adhesive systems initially used were based on a first-step dip of either an epoxide or a blocked polyisocyanate and then a second or top coat of RFL. Wenghoefer in his patent disclosed a somewhat different first step dip which consisted of bis(j3-azido-formyl oxyethyl)isophthalate. After drying, the cord thus treated, was then dipped in a phenolic adhesive and cured at 230 C for 60 seconds. A patent issued to Van Gils uses a one-step dip based on vinyl pyridine latex, trimethylol-phenol, resorcinol-formaldehyde resin, and... [Pg.592]

See other pages where Vinyl pyridine-based resins is mentioned: [Pg.91]    [Pg.91]    [Pg.175]    [Pg.521]    [Pg.521]    [Pg.315]    [Pg.178]    [Pg.232]    [Pg.772]    [Pg.208]    [Pg.256]    [Pg.256]    [Pg.192]    [Pg.203]    [Pg.286]    [Pg.772]    [Pg.237]    [Pg.191]    [Pg.772]    [Pg.282]    [Pg.282]   
See also in sourсe #XX -- [ Pg.91 ]

See also in sourсe #XX -- [ Pg.91 ]



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Pyridin bases

Pyridine bases

Vinyl pyridine

Vinyl resins

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