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Unconventional Epoxy Adhesives

This chapter considers epoxy adhesive formulations that are rather unconventional. These include [Pg.255]

These adhesives have found their way into several niche markets where their advantages, such as fast setting speed, are highly valued. They have not seen application in the more ordinary markets because of their materials and equipment cost. However, it is expected that these epoxy adhesive systems will grow at a faster annual rate than the average market as their advantages become more widely known. [Pg.255]

Formulation details are then presented in Chapters 11 through 14 for the various possible forms of epoxy adhesive systems room temperature and elevated-temperature curing liquids, pastes, and solids. The more or less unconventional forms of epoxy adhesives are also identified and discussed, since these are now achieving prominence in industry. These include uv and electron beam radiation curable, waterborne systems, and epoxy adhesives capable of curing via the indirect application of heat or energy. [Pg.552]

See other pages where Unconventional Epoxy Adhesives is mentioned: [Pg.255]    [Pg.257]    [Pg.259]    [Pg.261]    [Pg.263]    [Pg.265]    [Pg.267]    [Pg.269]    [Pg.271]    [Pg.273]    [Pg.275]    [Pg.277]    [Pg.279]    [Pg.281]    [Pg.283]    [Pg.285]    [Pg.287]    [Pg.289]    [Pg.255]    [Pg.257]    [Pg.259]    [Pg.261]    [Pg.263]    [Pg.265]    [Pg.267]    [Pg.269]    [Pg.271]    [Pg.273]    [Pg.275]    [Pg.277]    [Pg.279]    [Pg.281]    [Pg.283]    [Pg.285]    [Pg.287]    [Pg.289]   


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