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Trenches, superconformal electrodeposition

Defect-free deposits in vias and trenches, superconformal electrodeposition, may be achieved in the presence of additives. In superconformal deposition, electrodeposition... [Pg.328]

SUPERCONFORMAL ELECTRODEPOSITION OF COPPER INTO NANOMETER VIAS AND TRENCHES... [Pg.328]

The inhibition-acceleration mechanism. Moffat et al. (37) proposed the inhibition-acceleration mechanism to explain the experimentally observed comer rounding (inversion of curvature. Fig. 19 in Ref. 37) and general shape evolution in superconformal electrodeposition of copper in vias and trenches of nanometer dimensions (37,38). These authors also smdied a three-additive system composed of two inhibitors and one accelerator. They concluded that superconformal deposition and comer rounding may be attributed to competitive adsorption of inhibitor and accelerator. This model is based on the assumption of curvature (in vias and trenches) -enhanced accelerator coverage. [Pg.329]

See other pages where Trenches, superconformal electrodeposition is mentioned: [Pg.329]    [Pg.329]    [Pg.225]   
See also in sourсe #XX -- [ Pg.326 , Pg.327 , Pg.328 , Pg.329 ]



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