Treatment of Plated Parts

Thinly nickel-plated parts should not be etched or sanded. Two unique problems are often encountered when preparing and bonding plated metals  

Because the plating process produces a clean, bondable surface, freshly plated surfaces often do not require additional preparation. Keep in mind, however, that plating changes surface properties such as adhesion, porosity, and surface stress of the metal deposit. Current density, composition of the plating bath (including brightener content), and bath temperature affect the bondabiUty of the plated surface. 

When mechanical pretreatment is used, abrade the surface lightly. Fine grades of sand or abrasive paper will minimize penetration. The correct chemical treatment depends on the type of metal, which is deposited during the plating process. 

If the plating does not adhere tightly to the base metal, the plating process itself should be investigated. Application of Chemlok 205 or 207 primer (0.1—0.2 mil, 2.5—5 xm) (www.lord.com) often improves adhesion to plated metals. 

A recommended practice is light scouring with a nonchlorinated commercial cleaner, rinsing with distilled water, drying at below 49 °C, and then priming as soon as possible. 

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