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Through Hole Plating for Printed Wiring Boards

2 Through Hole Plating for Printed Wiring Boards [Pg.184]

Printed wiring boards consist of a substrate, typically a glass fiber-reinforced epoxy laminate, copper foils as conducting layers, and electronic components mounted on the laminate surface. For the majority of printed circuit boards the manufacturing process comprises these process steps  [Pg.184]

Holes are drilled into the board to take up leads of electronic components passed through the holes and soldered to the copper laminate wiring. Holes are usually plated with a thin layer of copper, which coimect the copper layers on the top and bottom sides of the board, and embedded copper layers in multilayer boards.  [Pg.184]

Chemical copper Palladium salts Copper sulfate, formaldehyde (reducing agent, EDTA (complexing agent) [Pg.185]

Palladium activated direct copper Palladium salts Copper salts, electrodeposition [Pg.185]




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Print-through

Printed wire boards

Printed wiring

Printed wiring boards

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