Thin-film copper cross section

Thin-film copper cross section. (From Krum, A., Course Notes, UCLA Extension, Engineering 881.152, Power Hybrids Design and Processing, April 1995. With permission.)... 

SEM scans the specimen surface with a high-energy electron beam. The microstructures of the deposited PAB films are studied in SEM as film surface and microtomed cross sections. For enhancing the contrast between PAB phases, partial dissolution (by solvent vapor) or erosion (by plasma treatment) may be needed. Furthermore, for preventing accumulation of the static electricity on the specimen surface, a thin layer of Au/Pt may be deposited. The specimens are placed on a platinized silicon wafer holder with a conductive adhesive copper tape. The modern SEM has high resolution. 

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