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Thick film pastes glass frit

Other small molecule species decompose and volatilise. The glass frit fuses, wetting the surface of the functional phase, providing adhesion and sealing of the composite to the substrate. Because of the screen printing process, resolution is modest. Fired film thicknesses, which range from 10 to 50 p.m (0.4 to 2.0 mils), are large compared to thin-fHm microelectronics. Some photosensitive pastes are also ia use. [Pg.126]

For obtaining the required thick-film adhesion, oxides (fritless conductors) can also be used. Small amounts (0.1-1%) of chemically active oxides like CuO, CdO, or NiO, added to the paste, react at high temperatures with alumina substrates to form oxides like CuAlO, which provide better adhesion. A combination of glass and oxides also is used, but the amount of glass in this case is much lower than in the fritted systems. Adhesion is believed to be related to a combination of the above-mentioned effects. Table 8.1 shows several examples of inks used for gas sensor fabrication. [Pg.252]

The glass frit type of thick film gold paste that has jnst been described is commonly used for electronic devices and sensors. The particle size of the gold powder is 3 xm or less, and particles will tend to be spherical in shape in order to achieve a dense film after firing. The finished electrode thickness after printing will usnaUy range from 1 to 20 pm, depending on particle size, metal content of the paste, etc. [Pg.282]


See other pages where Thick film pastes glass frit is mentioned: [Pg.384]    [Pg.307]    [Pg.158]    [Pg.279]    [Pg.125]    [Pg.125]    [Pg.126]    [Pg.125]    [Pg.126]    [Pg.236]    [Pg.331]    [Pg.14]    [Pg.322]    [Pg.331]    [Pg.620]    [Pg.279]   
See also in sourсe #XX -- [ Pg.282 , Pg.283 ]




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