Thick film devices material compatibility

However, such techniques require highly specialized substrates and/or large thermal budgets that might not be compatible with the more common, low cost metallic foUs, or glass substrates. Atomic layer deposition processes can provide precise control over material thickness however, such control requires low deposition rates, which would reduce device throughputs when thicker films are desired. Thus, a balance between semiconductor PEC performance and the cost, speed, and scalability of the material fabrication method must be considered. Commonly used techniques to fabricate semiconductor photoelectrodes include ... 

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