Thermosets dielectric analysis

Senturia, S. D., and Sheppard, N. F. (1986). Dielectric analysis of thermoset cure. In Advances in Polymer Science, Springer, Berlin, Germany, pp. 1-47. 

Sheppard, Jr., N. F. Dielectric analysis of the cure of thermosetting epoxy/amine systems, Ph.D. Thesis, Massachusetts Institute of Technology, 1985, unpublished... 

For non-elastomeric thermosets, Carrasco [13] described the use of DSC to follow the conversion during cure of a trifunctional aminoepoxy resin. Here, the conversion was determined versus a non-cured sample. Sauerbrunn [14] also described the use of DSC to follow fiiermoset curing amongst other applications. Stephan [15] utilized dielectric analysis (DEA) as well as DSC, viscosity measurements and insolubles analysis to follow the curing, cure state and... 

Dielectric analysis is used most frequently with thermoplastics to provide information on and an understanding of the molecular basis for relaxations. This is a more traditional context for DEA and ample information with munerous interesting examples is available in the literature, particularly in the text by McCrum (71) and the review by Chartoff (77). The reader is referred to these references for further insights. More recently, DEA has had extensive appUcations in the characterization and in situ process monitoring of the ciu-e of thermosets, particularly in the manufacturing of composites. Since this topic is not as well known, we summarize in a subsequent section some of the more salient aspects of the use of DEA for the cure characterization of thermosets. 

---