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Thermal shock resistance filler contents

Figure 5 shows the effects of filler content on thermal shock resistance at c/R - 0.2 for composites of silicon nitride, silicon carbide, silica, and alumina. The thermal shock resistance of resin filled with silicon nitride increases linearly with the volume fraction. The value of the thermal shock resistance is high, especially at higher volume fraction (Vf > 40%), that is, thermal shock resistance reaches 140 K (Figure 5a). The thermal shock resistance of composite filled with silicon carbide increases rapidly with the increase of filler content, and it reaches 135 K at Vf of 40%, which is similar to the case of silicon nitride (Figure 5b). In the case of silica-filled composites there is also an increase, but above a 30% volume fraction a plateau is reached (Figure 5c). Alumina-filled composites show a decrease in thermal shock resistance with filler content, then an almost constant value starting at Vf = 20% (Figure 5d). Figure 5 shows the effects of filler content on thermal shock resistance at c/R - 0.2 for composites of silicon nitride, silicon carbide, silica, and alumina. The thermal shock resistance of resin filled with silicon nitride increases linearly with the volume fraction. The value of the thermal shock resistance is high, especially at higher volume fraction (Vf > 40%), that is, thermal shock resistance reaches 140 K (Figure 5a). The thermal shock resistance of composite filled with silicon carbide increases rapidly with the increase of filler content, and it reaches 135 K at Vf of 40%, which is similar to the case of silicon nitride (Figure 5b). In the case of silica-filled composites there is also an increase, but above a 30% volume fraction a plateau is reached (Figure 5c). Alumina-filled composites show a decrease in thermal shock resistance with filler content, then an almost constant value starting at Vf = 20% (Figure 5d).
Figure 5. Effect of filler contents on thermal shock resistance at c/R = 0.2 (a) Si3N4, (b) SiC, (c) Si02, and (d) Al203. Figure 5. Effect of filler contents on thermal shock resistance at c/R = 0.2 (a) Si3N4, (b) SiC, (c) Si02, and (d) Al203.
On the other hand, in weakly bonded particulates such as alumina, thermal shock resistance decreases with increasing filler content. In this case, interfacial debonding occurs because of the difference in thermal expansion, and then the crack propagates through the interface preferentially. [Pg.137]

The effects of ceramic particles and filler content on the thermal shock behavior of toughened epoxy resins have been studied. Resins filled with stiff and strong particles, such as silicon nitride and silicon carbide, show high thermal shock resistance, and the effect of filler content is remarkable. At higher volume fractions (Vf > 40%), the thermal shock resistance of these composites reaches 140 K, whereas that of neat resin is about 90 K. The highest thermal shock resistance is obtained with silicon nitride. The thermal shock resistance of silica-filled composites also increases with increasing filler content, but above 30% of volume fraction it comes close to a certain value. On the contrary, in alumina-filled resin, the thermal shock resistance shows a decrease with increasing filler content. [Pg.140]


See other pages where Thermal shock resistance filler contents is mentioned: [Pg.128]    [Pg.129]    [Pg.134]    [Pg.137]    [Pg.116]    [Pg.26]    [Pg.608]   
See also in sourсe #XX -- [ Pg.125 , Pg.131 ]




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