The importance of photolithography for macro-, micro-, and nanofabrication

15 am). Resist system Novolak/DNQ (see Section 9.1.3.1). Adapted from Maciossek et al. [44] with permission from Leuze. 

Notably, the patterning of thick layers, commonly consisting of multiple coats of spun-cast polymer, necessitates a high transparency of the resist system. Therefore, care has to be taken that the maximum exposure depth exceeds the thickness of the layer. In special cases, the initiator/sensitizer is photobleached, thus causing the penetration depth of the incident fight to increase during exposure. 

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