Tape-cast silicon nitride

Another feature of this material is its narrow distribution of the fracture strength. When the strength distribution was expressed in Weibull statistics, the Weibull modulus was 46 - substantially higher than the value of 26 obtained for a conventional, self-reinforced silicon nitride. Thus, the seeded and tape-cast silicon nitride showed a synergistic improvement in all of the important fracture attributes, such as fracture strength, fracture toughness, and strength stability (Weibull modulus). 

Figure 8.7 Fracture toughness and strength of the seeded and tape-cast silicon nitride as a function of amount of P-seed costal addition. Reprinted with permission from Ref. [20] 1997, Elsevier Ltd.

Figure 8.16 R-curve behaviors determined by the AMDCB techniques for the seeded and tape-cast silicon nitrides with additives of 6.25 wt% Y2O3-1.0wt% AI2O3, 5wt%...

Figure 8.19 Fracture strength and fracture energies at room temperature (R.T.) and 1500°C of the seeded and tape-cast silicon nitride with Lu203-Si02 sintering additives and reference material (unseeded but otherwise...

Bitterlich, B., Heinrich, J.G. (2002), Aqueous tape casting of silicon nitride , JEur. Ceram. Soc., 22, 2427-2434. 

Gutierrez, C.A., Moreno, R. (2000), Tape casting of non-aqueous silicon nitride... 

Microstructures of the two GPS-ed silicon nitride materials (a) SN-F (not seeded, cold pressed), (b) SN-C (seeded, tape cast). Plasma etching highlights the epitaxial growth of P-sialon on P-Si3N4 cores (indicated by the arrows). 

Figure 8.5 Schematic illustration of fabrication procedure for silicon nitride with controlled grain orientation through seeding and tape casting. Reprinted with permission from Ref [19] ...

Figure 8.9 Microstructures of silicon nitrides, (a) a-powder with 2 wt% 3-seed crystals, tape-cast and gas-pressure-sintered at 1850°C for 6 h (b) a-powder without 3-seed crystals, hot-pressed at 1750°Cfor2 h (c) a-powderwithout...

Figure 8.14 Fracture toughness and strength for various silicon nitrides studied so far. papers. The filled circles (a) denote the self-reinforced material [3, 22, 38] the filled triangle (b) denotes the seeded and tape-cast material [19] the open triangle (c) denotes...

Figure 8.18 Microstructure of the silicon nitride fabricated through dispersing 3 wt% of P-seed crystals into the raw powder slurry of a-phase and Lu203-Si02 sintering additives and subsequent tape-casting, (a) Plane parallel...

Porous Silicon Nitride Through Tape-Casting... 

Substrates made by the multilayer process from tape cast alumina have received considerable attention in recent years for multichip module (MCM) applications. An MCM consists of an array of closely packed chips on an interconnect board several inches on a side. Cofired ceramic is attractive relative to organic laminates because its thermal conductivity is almost 2 orders of magnitude higher, an important consideration in high-density circuitry. In addition both alumina and aluminum nitride ceramics are more closely matched to silicon in CTE than are organic boards. For similar reasons, alumina and AIN are attractive for ball grid array (EGA) mounting of chips. ... 

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