Surface mount components

Figure 4.34 Surface-mounted components such as valves, gauges and pressure regulators of the NeSSI consortium [23] (by courtesy of CPAC).

A selection of components surface-mounted to carrier plates is shown in Figure 4.34. The carrier plates support the internal fluidic pipes and can also be equipped with electrical heaters to permit trace heating of the fluid. The surface-mounted components of this system are compatible with the backbone concept introduced in the following. 

A process scheme (Figure 4.87) consists of standardized surface-mount components and can be arranged on the screen to a customized system. The software also delivers a summary considering necessary seals and pipe fittings which can be used for ordering directly (Figure 4.88). 

Figure 2. Multilayer circuit board with surface mounted components.

Generally, some improvement in Tg will be required, partly because this will help retain the mechanical properties over a wider temperature range, and partly because the soldering of surface mounting components often puts a large heat load on the entire board and not just on one surface. 

Connecting the modular surface-mount components (and optional auxiliary components) in Fig. 10.1 is the NeSSI -bus, which provides the electrical power and communication functions for controlling actuators and transmitting... 

Fig. 10.6 Cutaway view of the flow path for a single surface mount component (in this case a 2-port toggle valve) in the Swagelok MPC system.

Fig. 10.7 Cutaway view of a five-position Swagelok MPC assembly with a manifold layer assembled below Position 3. At this position, flow is diverted in two directions - up to the surface-mount component and down into the manifold layer.

Fig. 10.8 Examples of substrate and manifold channels, flow components, and surface mount components fortheSwagelok MPC NeSSI system.

CIRCORTech provides the parts needed to construct a pMS3 system, build to order complete systems, and a wide range of SP76 surface mount components for NeSSl systems. They also provide services for designing and installing their pMS3 systems according to customer specihcahons. 

C) the underside view showing the tubesets and mounting feet attached, and (D) with the surface mount components mounted. 

Fig. 10.14 Initial NeSSI offering from Parker-Hannifin the Integrated Conditioning System (PICS) could accommodate both IH" and V/f surface mount components based on the original draft ANSI/ASI SP76 specification.

The Parker-Hannifin PICS system was replaced by the Intraflow System as their main NeSSi commercial product line. Of course, their previous experience with the PICS system helped them to produce a second-generation NeSSi system with unique architecture and some interesting abilities. Also, the large number of 1% inch SP76 surface mount components they have developed work with the new system as well. The Parker-Hannifin web site describes the Intraflow System as ... 

Fig. 10.17 Picture showing how SP76 modular surface-mount components are attached to one of the commercially available substrates.

The modular nature of the surface-mount components makes it very easy to assemble or reconfigure a fluidic system to meet the requirements of a particular analyzer or sensor. Figure 10.19 shows three simple examples of surface-mount component systems being used to provide all, or part, of an analytical interface. 

Cormier, D. R. (1991), Neural Network Based Surface Mount Component Verification, Master s Thesis, State University of New York at Buffalo, Buffalo, NY. 

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