Substrate materials ceramics glasses

Microabrasion using compressed air is a modification based on sandblasting, the micropowder blasting. This process enables all types of glass, ceramics and semiconductor materials, irrespective of their chemical composition and crystal structure, to be inexpensively processed down to the micrometer scale. The micropowder blasting is a masked procedure and works quasi-parallel on the whole substrate. A powder jet drives systematically over the substrate. Material is removed at the mask openings (see Figure 2.17). 

In the last section, we describe immobilization methods of Ti02 nanomaterials on different substrates which include glass, ceramic, stone, cement, zeolites, metallic and metal oxide materials and polymer substrates. 

Bondable substrates for aerobic and second-generation acrylics include clean as well as oily or "as received" metal polyurethanes, filled polycarbonates, filled nylon, phenolics, thermosets, wood, concrete, ceramics, glass, and other common materials of manufacture. Some thermoplastic materials are bonded better by using a second-generation acrylic adhesive. Examples are unfilled nylon, ABS, and rubber. 

The canasite glass-ceramic demonstrates high fracture resistance, which is favorable for the disk substrate application, in addition to a number of other favorable properties compared with standard nickel phosphide-coated aluminum ceramic substrate materials. These properties are ... 

The adhesive properties of the foregoing materials may be attributed to the polar nature of the polymers involved. Further, the isocyanates present in the compositions may react with any active hydrogen present in the substrate or with the films of water which are often present on the surfaces of such materials as ceramics, glass and metals. Such reactions result in good keying of the adhesive and permit the attainment of high bond strengths. 

It is also possible to bond silicone rubbers to various substrates which are not injection moulded. Such materials range from steel and aluminium to ceramics, glass or any other solid. 

Ceramic materials are the preferred basis for thick films produced with higher temepratures. Among them are substances like aluminium oxide, glass and quartz. For lower-temperature manufacturing, the assortment of substrate materials is more versatile. Plastic foils as well as specially prepared paper or cardboard are widespread materials. 

Polyimides are also being used in conjunction with silica fabric (which has a coefficient of expansion approximately one tenth that of E-glass) to produce laminates with expansion coefficients in the XY plane which are as low as 6-7 ppm, i.e. close to that of a ceramic chip carrier. This composite satisfies the requirement for a substrate material for direct attachment of the larger ( to 1 in dimension) leadless chip carriers which are used for mounting LSI and VLSI chips. ... 

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