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Spray Metal Cleaning Concentrate

Cloud Point 78C Recommended Use Dilution 1 40 Foam Height p 60C None [Pg.252]

Sodium Metasilicate Sodium Carbonate Sodium Hydroxide Monatrope 1250 (as supplied) Surfonic LF-17 [Pg.252]

Add in order listed with agitation, making sure each ingredient is dissolved before next addition. [Pg.124]

The etch rates of oxides in DHF vary dramatically with their chemical composition and deposition conditions. Ideally, it would be possible to control the oxide etch rate by the concentration of DHF, and the copper etch rate with a second, independent variable. Figure 2 shows the results of cleaning metallic copper deposited on hydrophobic silicon from a copper-spiked HF solution [2]. SC-2 solutions with varying HCl and HjOj flows and a total flow of 1,760 ml/min were dispensed in the nitrogen-purged environment of a spray acid processor. The concentration of HCl had little effect on the total Cu removed as measrrred by TXRF. [Pg.267]

See other pages where Spray Metal Cleaning Concentrate is mentioned: [Pg.252]    [Pg.252]    [Pg.124]    [Pg.252]    [Pg.252]    [Pg.124]    [Pg.309]    [Pg.370]    [Pg.177]    [Pg.101]    [Pg.142]    [Pg.51]    [Pg.458]    [Pg.177]    [Pg.1081]    [Pg.71]    [Pg.802]    [Pg.21]    [Pg.181]    [Pg.311]    [Pg.128]   


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