Spacer devices conductivity

It seems obvious that manufacturers of spacer devices should use only nonelectrostatic materials in the future. Certainly, it is not satisfactory to require the patient to remember a certain priming procedure, which is likely to jeopardize compliance. Metal is an obvious, robust, and safe choice for a nonelectrostatic spacer (24,34), since it earries no charge no matter how it is handled and requires no chemical treatment. Alternatively a nonelectrostatic plastic material (carbon black) has been produced by mixing a conductive material into the... 

Polyacetylene is considered to be the prototypical low band-gap polymer, but its potential uses in device applications have been hampered by its sensitivity to both oxygen and moisture in its pristine and doped states. Poly(thienylene vinylene) 2 has been extensively studied because it shares many of the useful attributes of polyacetylene but shows considerably improved environmental stability. The low band gap of PTV and its derivatives lends itself to potential applications in both its pristine and highly conductive doped state. Furthermore, the vinylene spacers between thiophene units allow substitution on the thiophene ring without disrupting the conjugation along the polymer backbone. 

When significant quantities of residue are associated with the protective device (i.e. cover, spacer, paper or gauze), it is not possible to determine whether the material was available for absorption, that is, was in contact with the skin. If the study is otherwise well-conducted and reported, one approach is to assume that this residue was not available for absorption, and recalculate the applied dose accordingly. 

T0 assure optimum conductance, the adhesive must be applied as thinly and uniformly as possible. To control the thicknesses bondlines, thermally conductive paste adhesives have been formulated with collapsible spacers. The spacers are reported to control bondline thickness to 1.2 mils. These adhesives were developed for stacked die packages, but may also be used to attach ICs and other devices to substrates in plastic EGAs, CSPs, and array packages based on flexible tape or plastic laminates.Bondline thicknesses and uniformity may also be achieved by using film or preform tape adhesives and controlling the applied pressure and heat during cure. 

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