Soldering process temperature

Fig. 1. The essence of the brazing/soldering processes (a) before brazing/soldering (b) heating to the brazing/soldering temperature, and (c)...

The manufacturers stress ease of processing as a particular feature of the material. Recommended melt temperatures are in the range 320-340°C and mould temperatures are 135-165°C. Mould shrinkage of glass-filled grades is usually of the order of 0.2-0.4% in the flow direction and up to twice this value in the transverse direction. The materials are notable for their ability to withstand vapour phase and infrared soldering processes. 

The loss of insulation resistance of a solder mask determined at elevated temperature and humidity is dependent mostly on the moisture content of the air. Elevated temperature alone does not cause a dramatic reduction of insulation resistance. The soldering process increases the insulation resistance of the solder masks examined. It is postulated that hot solder seals the surface of the solder mask, rendering a better moisture barrier. This study suggests higher insulation resistance should be obtained from solder masks with higher hydrophobic properties. 

Tinning is the process of applying a protective coating of tin to another metal. Flux is a material that is used to lower the melting temperature of the materials or to aid in their fusion in this and related soldering processes. Zinc chloride is a common tinning flux. 

Up to now the electrical connection of devices and conducting tracks is made by solder processes, and therefore the adhesives have to withstand temperatures of about 260°C for a short time without remarkable losses in their performance. Up to now, conducting adhesives for electrical connections as an alternative have been nsed in special applications only. 

---