Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Soldering Plated through hole

Surface-mount technology replaces previous methods of inserting component leads into plated through-holes of PWBs, wave soldering from the back side to flow solder into the holes, and simultaneously forming both mechanical and electrical connections. SMT is highly automated and currently the most widely used production process for the assembly of single-layer, double-sided, and multilayer circuit boards. [Pg.10]

Through hole Also a plate through hole (PTH). A hole in a substrate that extends completely through a substrate, is solder plated, and is intended for a component lead. [Pg.1315]

Ammonium phosphate [(NH4)3P04] retains clean solder and plated through-holes. [Pg.801]

Phosphoric acid retains clean solder traces and plated through-holes. - ... [Pg.809]

PCB Surface Finishes and Solderability Testing for Plated Through Holes... [Pg.1006]

There are three important constituents of a solder joint the two materials or surfaces to be joined and the solder itself Each has its own set of attributes and variables that contribute to the ease and quality of soldering. A delicate balance of material conditions and process parameters determine the solder joint appearance, resultant strength, and reliabihty of the soldered assembly. The composition of the solder, the surface finish on lead, pad or plated through-hole (PTH), environmental factors, chemical implications, and thermal conditions aU impact the soldering process. Each will be discussed. [Pg.1030]

FIGURE 45.2 The expansion upon solidification in a bismuth-containing solder alloy can cause solder fillets to fracture and lift from the plated through-hole annular pads (right). Compare this to the schematic on the left, which is indicative of a conventional tin-lead solder joint. [Pg.1044]

An adjunct to the surface-mount process, this method, sometimes referred to as intrusive reflow, allows the soldering of some through-hole (solder-tail) parts into plated-through holes on the circuit board during SMT oven reflow. This process can eliminate or reduce the need for wave soldering—a step prone to defects. [Pg.1096]

Freedman, G. M., Patel, K. B., Batchelder, R. G., Method and Process for Soldering Reflow-Compatible Plated Through-Hole Components into Printed Wiring Board in Order to Circumvent the Wave Soldering Process (Biuied Intrusive Reflow Soldering and Rework), Research Disclosure, May 2006, pp. 543-545. [Pg.1133]

See other pages where Soldering Plated through hole is mentioned: [Pg.587]    [Pg.587]    [Pg.158]    [Pg.143]    [Pg.235]    [Pg.143]    [Pg.13]    [Pg.19]    [Pg.218]    [Pg.10]    [Pg.13]    [Pg.20]    [Pg.262]    [Pg.100]    [Pg.337]    [Pg.11]    [Pg.14]    [Pg.21]    [Pg.264]    [Pg.46]    [Pg.255]    [Pg.294]    [Pg.316]    [Pg.598]    [Pg.751]    [Pg.766]    [Pg.769]    [Pg.797]    [Pg.803]    [Pg.911]    [Pg.951]    [Pg.1006]    [Pg.1014]    [Pg.1030]    [Pg.1064]    [Pg.1066]    [Pg.1067]    [Pg.1073]    [Pg.1097]    [Pg.1135]    [Pg.1145]    [Pg.1146]    [Pg.1148]   
See also in sourсe #XX -- [ Pg.5 , Pg.6 , Pg.44 , Pg.44 ]



SEARCH



Plated through-holes

Plating through hole

Through-hole

© 2024 chempedia.info