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Solder lead-free/metal interfaces

Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints... [Pg.465]

All solder joints contain numerous interfaces between terminal metallization, intermetaUic compounds, and solder. Properly manufactured high Pb-Sn flip chip solder joints should always fail in the solder in both puU and during accelerated thermal cycle tests. However, whether the joints consist of lead-bearing or lead-free solder reactions at interfaces can cause effects such as impurity snowplowing, KirkendaU voids, and excessive intermetaUic compound growth resulting in increased stress levels which can lead to premature failure at terminal pads. [Pg.974]

Dr. Suganuma has published more than 200 papers on various interface phenomena including ceramic/metal, metal/metal, and soldering. He also published two books on lead-free soldering. Now he has focused on lead-free soldering and conductive adhesives. [Pg.1024]

See other pages where Solder lead-free/metal interfaces is mentioned: [Pg.344]    [Pg.344]    [Pg.344]    [Pg.497]    [Pg.813]    [Pg.1024]    [Pg.1037]    [Pg.601]    [Pg.234]    [Pg.110]    [Pg.961]   


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Free metal

LEAD-FREE

Lead metal

Lead-free soldering

Lead-free solders

Lead-soldering

Metal solder

Metallic lead

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