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Silicon microneedle structures

The proposed fabrication process of microneedles and reservoir involves isotropic and anisotropic etching processes using standard silicon wafers. The desired shape of microneedle structures is controlled is achieved by controlling the etching timings at various processing steps. Three set of chrome masks were fabricated. Microneedle Mask MNl has been used to fabricate microneedle outside shape. Microneedle mask MN2 has been used to fabricate inner hole called lumen while the third microneedle Mask has been used for backside reservoir etching. [Pg.85]


See other pages where Silicon microneedle structures is mentioned: [Pg.337]    [Pg.340]    [Pg.337]    [Pg.340]    [Pg.342]    [Pg.84]    [Pg.341]    [Pg.342]    [Pg.207]    [Pg.2034]    [Pg.2130]    [Pg.445]    [Pg.84]    [Pg.88]   
See also in sourсe #XX -- [ Pg.339 , Pg.340 , Pg.341 , Pg.342 , Pg.343 , Pg.344 , Pg.345 ]




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