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Reverse plating

Pulse and Pulse reverse plating experiments have been performed on 0.5pm, 2 1 aspect ratio features. The resistivity of the copper deposits was measured using a four-point probe. Pre- and post-anneal measurements were takea The resistivity values of the deposits before annealing ranged from 2.2 to 2.5 pfi cm, as shown in Fig.3. A 5% reduction in resistivity was observed upon annealing. [Pg.64]

Figure 2. SEM pictures of pulse plated and pulse reverse plated features. Notice that void size decreases with decreasing pulse period. No voids are observed for pulse reverse plated specimens. Figure 2. SEM pictures of pulse plated and pulse reverse plated features. Notice that void size decreases with decreasing pulse period. No voids are observed for pulse reverse plated specimens.
Displays based on Electroplating Reactions are seldom found in the literature 617,621) jjj, devices, reversible plating on to transparent electrodes is u. ... [Pg.97]

B.N. Popov, M. Ramasubramanian, S.N. Popova, R.E. White, K.M. Yin, Galvanostatic pitlse and pulse reverse plating of zinc-nickel alloys firom sulfate electrolytes on a rotating disc electrode, Trans. [Pg.285]

Chandrasekar MS, Pushpavanam M (2008) Pulse and pulse reverse plating—conceptual, advantages and applications. Electrochim Acta 53 3313-3322... [Pg.204]

Glogowski and Castillo [37] used the reverse plate bending test to evaluate cast bronze alloys in paper mill white waters. Rectangular bars with holes drilled to simulate those in suction rolls were tested in accordance with TAPPI Technical Information Paper 0402-08 with simulated white water containing thiosulfate wicked into the holes [33], This test is better than the rotating beam test as a simulation of the fatigue that occurs at suction roU holes, since it incorporates a drilled hole geometry. [Pg.798]

PopovN, Yin K, White R. (1993) Galvanostatic pulse and pulse reverse plating of nickel-iron alloys from electrolytes containing organic compounds on a rotating disc electrode. JElectrochem Soc 140 1321-1330. [Pg.337]

Table 5.3 Process parameter used for nano nickel deposition by pulse reverse plating... Table 5.3 Process parameter used for nano nickel deposition by pulse reverse plating...
Yin K. M. (1996), Duplex diffirsion layer model for pulse with reverse plating . Surf. Coat. TechnoL, 88,162, doi 10.1016/80257-8972(96)02904-0. [Pg.125]

What is meant by Periodic Reverse Plating What is its effect ... [Pg.223]


See other pages where Reverse plating is mentioned: [Pg.385]    [Pg.527]    [Pg.185]    [Pg.186]    [Pg.773]    [Pg.527]    [Pg.385]    [Pg.153]    [Pg.455]    [Pg.501]    [Pg.180]    [Pg.322]    [Pg.2239]    [Pg.367]    [Pg.369]    [Pg.369]    [Pg.67]    [Pg.452]    [Pg.200]    [Pg.400]    [Pg.103]    [Pg.294]    [Pg.210]    [Pg.181]   
See also in sourсe #XX -- [ Pg.294 ]




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